电镀与涂饰
電鍍與塗飾
전도여도식
ELECTROPLATING & FINISHING
2014年
9期
369-372
,共4页
镀锡%溶锡%电解%离子交换膜%阻隔率%电流效率%锡利用率
鍍錫%溶錫%電解%離子交換膜%阻隔率%電流效率%錫利用率
도석%용석%전해%리자교환막%조격솔%전류효솔%석이용솔
tin plating%tin dissolution%electrolysis%ion-exchange membrane%rejection rate%current efficiency%tin utilization
分别在电流密度2 A/dm2和20 A/dm2下,考察了美国杜邦的N117CS型离子交换膜、国产科润的Nepem-417型离子交换膜以及日本旭硝子的HSF型氢离子选择透过膜电解溶锡时的电流效率、锡利用率以及离子交换膜对 Sn2+的阻隔率。结果表明,电流密度为2 A/dm2时,3种离子交换膜电解溶锡的电流效率、锡利用率以及三者对 Sn2+的阻隔率均相差不大;但电流密度为20 A/dm2、且保证Sn2+质量浓度为(28±2) g/L时,旭硝子HSF 型离子交换膜的各项性能都比另外两种离子交换膜理想,电流效率84.16%,锡利用率94.82%,对Sn2+的阻隔率96.24%。因此镀锡板生产中电解溶锡时宜选用HSF型离子交换膜。
分彆在電流密度2 A/dm2和20 A/dm2下,攷察瞭美國杜邦的N117CS型離子交換膜、國產科潤的Nepem-417型離子交換膜以及日本旭硝子的HSF型氫離子選擇透過膜電解溶錫時的電流效率、錫利用率以及離子交換膜對 Sn2+的阻隔率。結果錶明,電流密度為2 A/dm2時,3種離子交換膜電解溶錫的電流效率、錫利用率以及三者對 Sn2+的阻隔率均相差不大;但電流密度為20 A/dm2、且保證Sn2+質量濃度為(28±2) g/L時,旭硝子HSF 型離子交換膜的各項性能都比另外兩種離子交換膜理想,電流效率84.16%,錫利用率94.82%,對Sn2+的阻隔率96.24%。因此鍍錫闆生產中電解溶錫時宜選用HSF型離子交換膜。
분별재전류밀도2 A/dm2화20 A/dm2하,고찰료미국두방적N117CS형리자교환막、국산과윤적Nepem-417형리자교환막이급일본욱초자적HSF형경리자선택투과막전해용석시적전류효솔、석이용솔이급리자교환막대 Sn2+적조격솔。결과표명,전류밀도위2 A/dm2시,3충리자교환막전해용석적전류효솔、석이용솔이급삼자대 Sn2+적조격솔균상차불대;단전류밀도위20 A/dm2、차보증Sn2+질량농도위(28±2) g/L시,욱초자HSF 형리자교환막적각항성능도비령외량충리자교환막이상,전류효솔84.16%,석이용솔94.82%,대Sn2+적조격솔96.24%。인차도석판생산중전해용석시의선용HSF형리자교환막。
The current efficiency, tin utilization, and rejection rate of Sn2+during the electrolytic dissolution of tin with DuPont N117CS ion-exchange membrane, Kerun Nepem-417 ion-exchange membrane, or Japan Asahi Glass HSF ion-exchange membrane were studied at current density of 2 A/dm2 and 20 A/dm2, respectively. The results showed that there is little difference in the current efficiency, tin utilization, and rejection rate of Sn2+ when using the three above-mentioned ion-exchange membranes for electrolytic dissolution of tin at a current density of 2 A/dm2. However, at a current density of 20 A/dm2 and under the premise that the mass concentration of Sn2+ is kept to be 28±2 g/L, the performances of Asahi Glass HSF, i.e. current efficiency 84.16%, tin utilization 94.82%, and Sn2+ rejecting rate 96.24%, are more ideal than that of the other two kinds of ion-exchange membrane. Therefore it is reasonable to select the HSF ion-exchange membrane for electrolytic dissolution of tin during the production of tinplate.