CAJ | 학술논문

传统的MEMS系统级封装多采用IC标准的封装形式，例如塑料封装形式、陶瓷管壳封装形式、TO 系列金属管壳封装。由于大过载传感器需要工作环境冲击振动比较高，陶瓷管壳容易破碎；塑封采用热塑成型，封装后残余应力大；TO系列管壳体积较大，并且采用直插形式安装，在超过5×103g冲击下，管脚容易折断。针对这种情况，本文提出了一种新型 MEMS 加速度计封装方法，在圆片级采用玻璃-硅-玻璃三层结构，并采用铝金属壳体螺钉安装并在壳体内部双组分环氧树脂灌封。封装之后的大过载加速度计具有体积小，密封性强，残余应力小、抗强冲击、稳定性好、适应于小批量生产等优点。
전통적MEMS계통급봉장다채용IC표준적봉장형식，례여소료봉장형식、도자관각봉장형식、TO 계렬금속관각봉장。유우대과재전감기수요공작배경충격진동비교고，도자관각용역파쇄；소봉채용열소성형，봉장후잔여응력대；TO계렬관각체적교대，병차채용직삽형식안장，재초과5×103g충격하，관각용역절단。침대저충정황，본문제출료일충신형 MEMS 가속도계봉장방법，재원편급채용파리-규-파리삼층결구，병채용려금속각체라정안장병재각체내부쌍조분배양수지관봉。봉장지후적대과재가속도계구유체적소，밀봉성강，잔여응력소、항강충격、은정성호、괄응우소비량생산등우점。
Standard IC (Integrated Circuit) package has been adopted in traditional system-level packaging of MEMS devices, such as plastic packages, shell packages of ceramic and shell packages of TO metal. Ceramic shell is easily broken due to the causes such as:the impact of high-g sensors is relatively high;large residual stress remains after thermoplastic encapsulation;shell of TO series is too large and pin is easily broken under the impact of more than 5×103g owing to the line installation. In response, this paper presents a new package method for MEMS accelerometer, which adopts glass-silicon-glass structure at wafer level and introduces an aluminum shell filled with two-component epoxy resin at system level. There are many advantages of the accelerometer after package, such as small volume, strong sealing, little residual stress, high-impact resistance, good stability, and suitable for small batch production, etc.