CAJ | 학술논문

随着科技的进步，电子设备也向着集成度更高、功率更大、可靠性要求更严格的方向发展。高温引起的电子设备失效作为最常见的失效原因之一，也越来越引起设计者的重视。通过常规的制备样品反复试验的方法耗时耗力，而采用仿真模拟的办法就能很好地解决问题。文章从使用高导热封装材料、添加散热盖和改善封装结构等方面，应用仿真模拟的手段来比较各种优化设计的改善程度，在散热优化方面为今后的BGA设计提供了参考。
수착과기적진보，전자설비야향착집성도경고、공솔경대、가고성요구경엄격적방향발전。고온인기적전자설비실효작위최상견적실효원인지일，야월래월인기설계자적중시。통과상규적제비양품반복시험적방법모시모력，이채용방진모의적판법취능흔호지해결문제。문장종사용고도열봉장재료、첨가산열개화개선봉장결구등방면，응용방진모의적수단래비교각충우화설계적개선정도，재산열우화방면위금후적BGA설계제공료삼고。
Thermal management of packaging is very important to the reliability and quality of electrical products. In this study, a simulation method is proposed to evaluate the thermal performance of BGA609P attached on printed circuit board(PCB). Flotherm Computational Fluid Dynamics(CFD)software is employed to predict the package thermal performance. The simulation results show that thermal conductivity of BT material, thermal conductivity of molding compound, structural change of via and substrate, produce some opening in solder-mask have significant impact on thermal resistance of BGA609P.