电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2013年
9期
1-5
,共5页
杨轶博%丁荣峥%高娜燕%李欣燕
楊軼博%丁榮崢%高娜燕%李訢燕
양질박%정영쟁%고나연%리흔연
信号噪声%反射%串扰%同步开关噪声%信号完整性%电源完整性
信號譟聲%反射%串擾%同步開關譟聲%信號完整性%電源完整性
신호조성%반사%천우%동보개관조성%신호완정성%전원완정성
signal noise%relfection%cross-talk%SSN%SI%PI
随着陶瓷封装电路密度、频率和速度不断提高，电信号噪声问题凸显。信号噪声本质上源于传输线本身存在的寄生电阻、电容、电感与电信号作用导致的一系列信号质量下降、参考电位不稳定等问题。高频高密度陶瓷电设计常见的信号噪声问题包括反射、串扰和同步开关噪声等。文章分析了陶瓷封装设计中三类噪声产生的原因、危害及解决措施，并基于信号/电源完整性理论，介绍了一款高频高密度陶瓷基板的封装电设计。
隨著陶瓷封裝電路密度、頻率和速度不斷提高，電信號譟聲問題凸顯。信號譟聲本質上源于傳輸線本身存在的寄生電阻、電容、電感與電信號作用導緻的一繫列信號質量下降、參攷電位不穩定等問題。高頻高密度陶瓷電設計常見的信號譟聲問題包括反射、串擾和同步開關譟聲等。文章分析瞭陶瓷封裝設計中三類譟聲產生的原因、危害及解決措施，併基于信號/電源完整性理論，介紹瞭一款高頻高密度陶瓷基闆的封裝電設計。
수착도자봉장전로밀도、빈솔화속도불단제고，전신호조성문제철현。신호조성본질상원우전수선본신존재적기생전조、전용、전감여전신호작용도치적일계렬신호질량하강、삼고전위불은정등문제。고빈고밀도도자전설계상견적신호조성문제포괄반사、천우화동보개관조성등。문장분석료도자봉장설계중삼류조성산생적원인、위해급해결조시，병기우신호/전원완정성이론，개소료일관고빈고밀도도자기판적봉장전설계。
With the increasing of the density, frequency and transmission speed of ICs, the problems of electric signal noise are becoming more and more remarkable in the term of package interconnections. The substance of signal noise is the problem such as the decay of signal quality and the instability of reference voltage, which are induced by parasitic RCL of transmission line. Relfection, cross-talk and SSN are very common electrical noise problems in high-density ceramic package designing. This paper introduces causes, harm and solutions of the three SI/PI problems in ceramic package designing. Based on SI/PI theories, the designing of one ceramic substrate with high density and frequency is introduced.
