CAJ | 학술논문

在印制电路板化学镀镍/金过程中，镍、金原子固有的结构特征使镍镀层极易被氧化腐蚀，从而影响镀层的可焊性。从化学镀Ni-P基多元合金，引入纳米粒子和稀土材料，以及化学镀Ni-B合金三方面，介绍了改善印制电路板化学镀镍层耐蚀性的研究现状。对印制电路板化学镀镍耐蚀性的改善方法提出了建议。
재인제전로판화학도얼/금과정중，얼、금원자고유적결구특정사얼도층겁역피양화부식，종이영향도층적가한성。종화학도Ni-P기다원합금，인입납미입자화희토재료，이급화학도Ni-B합금삼방면，개소료개선인제전로판화학도얼층내식성적연구현상。대인제전로판화학도얼내식성적개선방법제출료건의。
Oxidation corrosion of nickel coating occurs easily during the electroless nickel/gold plating process on the surface of printed circuit board because of the inherent structure features of nickel and gold atoms, thus affecting the solderability of coating. The research progress of improvement of corrosion resistance of electroless nickel coating on printed circuit board was introduced from three aspects including electroless Ni-P-based multicomponent alloy plating, introduction of nanoparticles and rare earth materials, and electroless Ni-B alloy. Some suggestions about improvement method of corrosion resistance of electroless nickel coating on printed circuit board were proposed.