电镀与涂饰
電鍍與塗飾
전도여도식
ELECTROPLATING & FINISHING
2013年
9期
28-30
,共3页
滚镀铜%无氰%应用%故障排除
滾鍍銅%無氰%應用%故障排除
곤도동%무청%응용%고장배제
barrel copper plating%cyanide-free%application%troubleshooting
介绍了铁基无氰滚镀铜工艺条件和镀液的维护，提出以总有效配位剂和铜离子含量的比值(n)作为控制和维护镀液的依据，n保持在1.1~1.4为宜。重点阐述了无氰滚镀铜工艺中的常见故障和解决措施。
介紹瞭鐵基無氰滾鍍銅工藝條件和鍍液的維護，提齣以總有效配位劑和銅離子含量的比值(n)作為控製和維護鍍液的依據，n保持在1.1~1.4為宜。重點闡述瞭無氰滾鍍銅工藝中的常見故障和解決措施。
개소료철기무청곤도동공예조건화도액적유호，제출이총유효배위제화동리자함량적비치(n)작위공제화유호도액적의거，n보지재1.1~1.4위의。중점천술료무청곤도동공예중적상견고장화해결조시。
The process conditions and bath maintenance of cyanide-free barrel copper plating on iron substrate were introduced. It is proposed that the bath can be controlled and maintained based on the proportion of total effective complexing agent vs. copper ions content (n), which is optimal at 1.1~ 1.4. Some common malfunctions and their corresponding solutions for cyanide-free barrel copper plating were empathetically stated.
