CAJ | 학술논문

采用搅拌辅助低温(半固态区间)钎焊技术，制备低银无铅钎料和纳米复合钎料钎焊接头。结果表明：240℃时复合钎料的润湿时间较基体的润湿时间缩短了31%，润湿力较基体的提高了3.8%；机械搅拌在破碎树枝晶和加速元素扩散的同时，降低了液相的温度梯度和成分过冷，大大削弱了钎料基体中金属间化合物(IMC)Cu6Sn5的枝晶生长，促使针状Cu6Sn5破碎呈短棒状；在低银无铅钎料中加入纳米Ni颗粒，Ni与Cu6Sn5生成孔洞状化合物(CuxNi1?x)6Sn5及低温搅拌形成的气孔成为界面原子的扩散通道。搅拌形成的紊流和热流传递加快了原子的溶解与扩散，加速了界面IMC的生长。
채용교반보조저온(반고태구간)천한기술，제비저은무연천료화납미복합천료천한접두。결과표명：240℃시복합천료적윤습시간교기체적윤습시간축단료31%，윤습력교기체적제고료3.8%；궤계교반재파쇄수지정화가속원소확산적동시，강저료액상적온도제도화성분과랭，대대삭약료천료기체중금속간화합물(IMC)Cu6Sn5적지정생장，촉사침상Cu6Sn5파쇄정단봉상；재저은무연천료중가입납미Ni과립，Ni여Cu6Sn5생성공동상화합물(CuxNi1?x)6Sn5급저온교반형성적기공성위계면원자적확산통도。교반형성적문류화열류전체가쾌료원자적용해여확산，가속료계면IMC적생장。
The soldering joints of low silver solder and nano-particle lead-free Sn-Cu-Ag composite solder were prepared by the technology of low-temperature soldering (at semi-solid state) with stirring, respectively. The results show that the wetting time of nano-particle composite solder is decreased by 31% at 240 ℃, and the wetting power is increased by 3.8%compared those of with the matrix. Mechanical mixing can break dendrites and accelerate the diffusion of elements, and also reduce the temperature gradient and the composition undercooling of the liquid, thus, greatly weaken the growth of IMC-Cu6Sn5 dendrite in solder matrix and making needle-shaped intermetallic compound (IMC) Cu6Sn5 break into short rod-like. After adding nano-Ni particles into the low silver solder, cavitary compounds of (CuxNi1?x) 6 Sn5 generated by Ni with Cu6Sn5 and the porosities formed by stirring at low temperature are as the diffusion path of interface atoms. The turbulent flow and heat flow due to stirring accelerate the dissolution and diffusion of the atom, and speed up the growth of IMC.