表面技术
錶麵技術
표면기술
SURFACE TECHNOLOGY
2014年
4期
92-96
,共5页
石璐丹%刘科高%张力%高稳成
石璐丹%劉科高%張力%高穩成
석로단%류과고%장력%고은성
电沉积%CuS 薄膜%镀液性能
電沉積%CuS 薄膜%鍍液性能
전침적%CuS 박막%도액성능
electrodeposition%CuS thin films%performance of plating solution
目的:获得结晶好、连续均匀的 CuS 薄膜。方法采用电沉积方法制备 CuS 薄膜,研究络合剂、硫源及铜硫离子比例对镀液电化学性能的影响,分析不同沉积电位下所得薄膜的相组成。结果柠檬酸钠的络合效果最好,EDTA 最差;硫代硫酸钠作为硫源时,其还原电位较硫脲为硫源时正,氧化电位较负,水平距离值较小,更容易实现共沉积;铜硫离子比例为1时,施镀最合适。沉积电位为-0.8 V 时,薄膜的XRD 图谱中有氧化亚铜的衍射峰;当沉积电位在-0.9 V 时,生成了 Cu2 S 相;沉积电位在-0.9~-1.2 V时,生成了目标产物 CuS,并且-1.2 V 时的衍射峰强度比较高,结晶良好。结论最佳沉积条件如下:柠檬酸钠为络合剂,硫代硫酸钠为硫源,铜硫离子比为1,沉积电位为-1.2 V。
目的:穫得結晶好、連續均勻的 CuS 薄膜。方法採用電沉積方法製備 CuS 薄膜,研究絡閤劑、硫源及銅硫離子比例對鍍液電化學性能的影響,分析不同沉積電位下所得薄膜的相組成。結果檸檬痠鈉的絡閤效果最好,EDTA 最差;硫代硫痠鈉作為硫源時,其還原電位較硫脲為硫源時正,氧化電位較負,水平距離值較小,更容易實現共沉積;銅硫離子比例為1時,施鍍最閤適。沉積電位為-0.8 V 時,薄膜的XRD 圖譜中有氧化亞銅的衍射峰;噹沉積電位在-0.9 V 時,生成瞭 Cu2 S 相;沉積電位在-0.9~-1.2 V時,生成瞭目標產物 CuS,併且-1.2 V 時的衍射峰彊度比較高,結晶良好。結論最佳沉積條件如下:檸檬痠鈉為絡閤劑,硫代硫痠鈉為硫源,銅硫離子比為1,沉積電位為-1.2 V。
목적:획득결정호、련속균균적 CuS 박막。방법채용전침적방법제비 CuS 박막,연구락합제、류원급동류리자비례대도액전화학성능적영향,분석불동침적전위하소득박막적상조성。결과저몽산납적락합효과최호,EDTA 최차;류대류산납작위류원시,기환원전위교류뇨위류원시정,양화전위교부,수평거리치교소,경용역실현공침적;동류리자비례위1시,시도최합괄。침적전위위-0.8 V 시,박막적XRD 도보중유양화아동적연사봉;당침적전위재-0.9 V 시,생성료 Cu2 S 상;침적전위재-0.9~-1.2 V시,생성료목표산물 CuS,병차-1.2 V 시적연사봉강도비교고,결정량호。결론최가침적조건여하:저몽산납위락합제,류대류산납위류원,동류리자비위1,침적전위위-1.2 V。
Objective To get good crystallization and continuous uniform CuS thin film. Methods The Cus thin film was pre-pared by the method of electrodeposition, so as to investigate the effect of complexing agent, sulfur sources and copper sulfion ion proportion on electrochemical properties of the plating solution, and analyze the phase composition of thin film in different deposi-tion potential. Results The experimental results showed that sodium citrate was the best complexing agent, while EDTA was the worst. When choosing sodium thiosulfate as the source of sulfur, its reduction potential compared with thiourea would be more posi-tive, oxidation potential would be more negative and the horizontal distance would have smaller values, which was easier to imple-ment codeposition. The ratio of copper sulfide ion to 1 was the most suitable plating condition. When the deposition potential at-0. 8 V, the XRD atlas of thin film appeared the diffraction peaks of cuprous oxide; when the deposition potential at -0. 9 V, Cu2 S phase generated; when the deposition potential at -0. 9 ~ -1. 2 V, the target products CuS was produced, and the diffraction peaks intensity were higher. Conclusion The best depositional conditions are as following: sodium citrate as complexing agent, so-dium thiosulfate as a source of sulfur, the ratio of copper and sulfur ion to 1, deposition potential at -1. 2 V.