表面技术
錶麵技術
표면기술
SURFACE TECHNOLOGY
2014年
4期
24-26,36
,共4页
张琳琪%夏琳%彭进%邹文俊
張琳琪%夏琳%彭進%鄒文俊
장림기%하림%팽진%추문준
硅溶胶%CMP 抛光液%pH 值%表面活性剂
硅溶膠%CMP 拋光液%pH 值%錶麵活性劑
규용효%CMP 포광액%pH 치%표면활성제
silica sol%CMP slurry%pH value%surfactant
目的：研究 pH 值以及表面活性剂种类对 CMP 抛光液稳定性及抛光性能的影响。方法向硅溶胶中加入酸性或碱性 pH 值调节剂，配制不同 pH 值的 CMP 抛光液；通过添加不同类型的表面活性剂，研究表面活性剂对抛光液的稳定机理。结果硅溶胶 CMP 抛光液 pH 值为9.5时，加入非离子表面活性剂，抛光90 min 后，铝合金表面粗糙度降低了55.4%，光亮度增加了131%，抛光质量较好。结论弱碱环境下，抛光液的稳定性和抛光性能优良，非离子表面活性剂有利于 CMP 抛光液的稳定性。
目的：研究 pH 值以及錶麵活性劑種類對 CMP 拋光液穩定性及拋光性能的影響。方法嚮硅溶膠中加入痠性或堿性 pH 值調節劑，配製不同 pH 值的 CMP 拋光液；通過添加不同類型的錶麵活性劑，研究錶麵活性劑對拋光液的穩定機理。結果硅溶膠 CMP 拋光液 pH 值為9.5時，加入非離子錶麵活性劑，拋光90 min 後，鋁閤金錶麵粗糙度降低瞭55.4%，光亮度增加瞭131%，拋光質量較好。結論弱堿環境下，拋光液的穩定性和拋光性能優良，非離子錶麵活性劑有利于 CMP 拋光液的穩定性。
목적：연구 pH 치이급표면활성제충류대 CMP 포광액은정성급포광성능적영향。방법향규용효중가입산성혹감성 pH 치조절제，배제불동 pH 치적 CMP 포광액；통과첨가불동류형적표면활성제，연구표면활성제대포광액적은정궤리。결과규용효 CMP 포광액 pH 치위9.5시，가입비리자표면활성제，포광90 min 후，려합금표면조조도강저료55.4%，광량도증가료131%，포광질량교호。결론약감배경하，포광액적은정성화포광성능우량，비리자표면활성제유리우 CMP 포광액적은정성。
Objective On the basis of preparing silicon sol polishing liquid for CMP process, the effects of pH value and surfac-tants on the reliability and properties of CMP slurry were studied. Methods Different pH values of CMP polishing liquid were con-figured through adding acidic or alkaline pH adjusting agent into the polishing liquid. The stabilizing mechanism of surfactants on the polishing solution was studied. Results When the pH of CMP solution was 9. 5, and Non-ionic surfactant was added, after 90 min, the surface roughness of polished aluminum alloy was decreased by 55. 4% , and the brightness was increased by 131% . The polishing quality of aluminum alloy surface was good. Conclusion Research showed the excellent stability and polishing perfor-mance of the polishing solution in weakly alkaline condition. Non-ionic surfactants were beneficial to the stability of CMP polishing liquid.
