CAJ | 학술논문

In柱制备是红外焦平面器件倒焊互连的关键工艺， In柱高度是评价In柱制备工艺水平的基本指标。通常的In柱高度统计方法为随机采样人工显微镜观测法，此方法由于采样点较少将导致统计结果不全面，另一方面由于In柱表面形貌的微观特性，人工显微镜观测引入的主观偏差将使统计结果不准确。提出了一种更合理可行的In柱高度统计方法，首先使用激光共聚焦显微镜对In柱表面形貌进行扫描，再利用MATLAB软件对扫描数据进行分析以统计In柱高度，分析时考虑In柱表面微观形貌对In柱高度的影响。利用此方法对16×16面阵的红外焦平面器件读出电路进行了In柱高度统计，统计结果优于随机采样人工显微镜观测法。为评价In柱制备工艺水平提供了更客观准确的In柱高度数据。
In주제비시홍외초평면기건도한호련적관건공예， In주고도시평개In주제비공예수평적기본지표。통상적In주고도통계방법위수궤채양인공현미경관측법，차방법유우채양점교소장도치통계결과불전면，령일방면유우In주표면형모적미관특성，인공현미경관측인입적주관편차장사통계결과불준학。제출료일충경합리가행적In주고도통계방법，수선사용격광공취초현미경대In주표면형모진행소묘，재이용MATLAB연건대소묘수거진행분석이통계In주고도，분석시고필In주표면미관형모대In주고도적영향。이용차방법대16×16면진적홍외초평면기건독출전로진행료In주고도통계，통계결과우우수궤채양인공현미경관측법。위평개In주제비공예수평제공료경객관준학적In주고도수거。
Indium bump fabrication is a key step of infrared focal plane arrays (IRFPAs) process with flip-chip bonding between sensor chip and Si readout integrated circuits (ROICs), and indium bump height is an important factor of indium bump fabrication quality. The usual method for indium bump height statistics is manual observation of the randomly picked indium bump by microscope. However, it can′t comprehensively reflect the true situation for the lack of enough samples. On the other hand, the subjectivity of manual observation makes the statistical results inaccurate. In this paper, an improved method of the statistics of indium bump height was stated. First, the confocal laser scanning microscopy (CLSM) was used to scan the surface morphology of the indium bump arrays, then, MATLAB was used to work out the specific indium bump heights by analyzing the data CLSM scanned, when concerning the morphology′s influence on the calculation of indium bumps. A real statistic of 16 ×16 format ROIC was done, and the result was better than manual observation. It can provide indium height data with great accuracy for evaluating the indium fabrication quality by using this method.