中国基础科学
中國基礎科學
중국기출과학
CHINA BASIC SCIENCE
2013年
4期
28-35
,共8页
高密度封装%倒装键合%精密操作%视觉定位
高密度封裝%倒裝鍵閤%精密操作%視覺定位
고밀도봉장%도장건합%정밀조작%시각정위
high-density packaging%flip-chip bonding%precise manipulation%vision positioning
针对超薄高密度芯片倒装键合，我们在超薄芯片的表面作用机理与高效剥离、基于飞行视觉的多自由度高精对准与高效贴片、键合界面接触电阻的建模计算及精确控制等方面取得重要进展。主要创新工作包括：（1）揭示了微薄芯片拾取过程中剥离与碎裂的竞争行为及其影响机理，发明了基于串并联混合机构的四自由度贴片装置及其力/位控制方法，实现了超薄芯片的无损拾取和多自由度高效高精贴片；（2）发明了基于多反射镜的飞行视觉定位装置，提出了多自由度调平、图像质量改善与超分辨率重建等图像处理方法，实现了高精快速定位；（3）揭示了超薄芯片倒装键合界面形成机理，发现了导电胶倒装键合中接触电阻“弯曲效应”，提出了键合压力、温度、基板张力等协同控制方法及装置；（4）研制了基于各向异性导电胶倒装热压焊工艺的高密度芯片倒装键合原型机，实现了最大芯片尺寸5 mm ×5 mm、芯片间距15μm的高密度芯片封装。
針對超薄高密度芯片倒裝鍵閤，我們在超薄芯片的錶麵作用機理與高效剝離、基于飛行視覺的多自由度高精對準與高效貼片、鍵閤界麵接觸電阻的建模計算及精確控製等方麵取得重要進展。主要創新工作包括：（1）揭示瞭微薄芯片拾取過程中剝離與碎裂的競爭行為及其影響機理，髮明瞭基于串併聯混閤機構的四自由度貼片裝置及其力/位控製方法，實現瞭超薄芯片的無損拾取和多自由度高效高精貼片；（2）髮明瞭基于多反射鏡的飛行視覺定位裝置，提齣瞭多自由度調平、圖像質量改善與超分辨率重建等圖像處理方法，實現瞭高精快速定位；（3）揭示瞭超薄芯片倒裝鍵閤界麵形成機理，髮現瞭導電膠倒裝鍵閤中接觸電阻“彎麯效應”，提齣瞭鍵閤壓力、溫度、基闆張力等協同控製方法及裝置；（4）研製瞭基于各嚮異性導電膠倒裝熱壓銲工藝的高密度芯片倒裝鍵閤原型機，實現瞭最大芯片呎吋5 mm ×5 mm、芯片間距15μm的高密度芯片封裝。
침대초박고밀도심편도장건합，아문재초박심편적표면작용궤리여고효박리、기우비행시각적다자유도고정대준여고효첩편、건합계면접촉전조적건모계산급정학공제등방면취득중요진전。주요창신공작포괄：（1）게시료미박심편습취과정중박리여쇄렬적경쟁행위급기영향궤리，발명료기우천병련혼합궤구적사자유도첩편장치급기력/위공제방법，실현료초박심편적무손습취화다자유도고효고정첩편；（2）발명료기우다반사경적비행시각정위장치，제출료다자유도조평、도상질량개선여초분변솔중건등도상처리방법，실현료고정쾌속정위；（3）게시료초박심편도장건합계면형성궤리，발현료도전효도장건합중접촉전조“만곡효응”，제출료건합압력、온도、기판장력등협동공제방법급장치；（4）연제료기우각향이성도전효도장열압한공예적고밀도심편도장건합원형궤，실현료최대심편척촌5 mm ×5 mm、심편간거15μm적고밀도심편봉장。
For ultra-thin high-density flip-chip bonding , great achievements , including ultra-thin chips'surface operat-ing mechanism and peeling , flying vision based precise alignment and efficient mounting , modeling , calculating and control of interface contact resistance , have been made during the research period .Major innovations in-cluded: ( 1 ) revealing a modest pickup chip peeling and chipping process and its impact on the competitive behavior of the mechanism , and inventing a series-par-allel hybrid mechanism based on four degrees of free-dom patch device and force /position control method to achieve a ultra-thin chips lossless efficient pick and multi-DOF high precision SMD; ( 2 ) inventing a flight vision method based on multi-vision mirror positioning device, proposing a multi-degree of freedom leveling , image quality improving and super-resolution recon-struction of image processing method to achieve a high-precision rapid positioning; ( 3 ) revealing a slim flip-chip bonding interface formation mechanism , discove-ring the conductive adhesive flip-chip bonding in con-tact resistance “bending effect”, put forwarding the bonding pressure , temperature , substrate tension coop-erative control method and apparatus; ( 4 ) based on ACF ( Anisotropic Conductive Film ) flip hot welding , developing a high-density flip-chip bonding apparatus prototype , based on which , the flip-chip bonding for high-density chips with maximum chip size 5mm × 5mm, pitch 15μm, is achieved.
