CAJ | 학술논문

在超大规模集成电路（ IC）制造过程中，晶圆需要在数百道工艺之间频繁传输，晶圆传输能力对整个IC产业的发展至关重要。晶圆传输机器人是IC制造领域的关键设备之一，承担着晶圆定位与快速、平稳搬运任务。随着IC制造向着大尺寸（直径≥300 mm ）晶圆与小线宽（≤32 nm ）方向发展，晶圆生产线工序更集中，加工速度更快，工作环境更洁净，这对晶圆传输机器人性能提出了更高要求。为了实现大尺寸超薄晶圆的高效稳定传输，我们从晶圆传输机器人精确平稳轨迹跟踪控制、面向晶圆传输的微阵列传输面设计以及接触面微力与粘滑检测触觉传感器设计等3个方面开展了研究。针对现有晶圆传输机器人样机中各个运动关节不同步和末端手的振动问题，我们提出把交叉耦合控制技术和输入整形控制同时应用到平面关节型晶圆传输机器人中，达到减小轨迹跟踪时的轮廓误差和消除柔性传动环节引起的末端执行器振动的目的，实现了机器人精确平稳轨迹跟踪控制。针对目前凸点支承式末端执行器传输晶圆时摩擦系数较小、传输效率低下的不足，我们提出了一种基于微米级垂直微阵列结构的新型晶圆传输面设计方法，实验表明该方法有效提高了晶圆传输加速度，可显著提高晶圆传输效率。针对大尺寸晶圆高效可靠传输过程中接触信息检测需求，我们提出了一种新型的晶圆传输接触面微力与粘滑传感器系统方案，即利用压敏导电墨（ PSCI ）的压阻效应实现三维力测量以及利用电磁感应原理实现粘滑检测，并通过实验验证了该方法的可行性。本文依次从问题提出、国内外研究现状分析、研究特色与实验验证等方面分别对上述3个部分的研究内容进行了分析与阐述。最后，结合上述分析，本文对现阶段的研究成果进行了总结，并提出了下一步的研究设想。在超大規模集成電路（ IC）製造過程中，晶圓需要在數百道工藝之間頻繁傳輸，晶圓傳輸能力對整箇IC產業的髮展至關重要。晶圓傳輸機器人是IC製造領域的關鍵設備之一，承擔著晶圓定位與快速、平穩搬運任務。隨著IC製造嚮著大呎吋（直徑≥300 mm ）晶圓與小線寬（≤32 nm ）方嚮髮展，晶圓生產線工序更集中，加工速度更快，工作環境更潔淨，這對晶圓傳輸機器人性能提齣瞭更高要求。為瞭實現大呎吋超薄晶圓的高效穩定傳輸，我們從晶圓傳輸機器人精確平穩軌跡跟蹤控製、麵嚮晶圓傳輸的微陣列傳輸麵設計以及接觸麵微力與粘滑檢測觸覺傳感器設計等3箇方麵開展瞭研究。針對現有晶圓傳輸機器人樣機中各箇運動關節不同步和末耑手的振動問題，我們提齣把交扠耦閤控製技術和輸入整形控製同時應用到平麵關節型晶圓傳輸機器人中，達到減小軌跡跟蹤時的輪廓誤差和消除柔性傳動環節引起的末耑執行器振動的目的，實現瞭機器人精確平穩軌跡跟蹤控製。針對目前凸點支承式末耑執行器傳輸晶圓時摩抆繫數較小、傳輸效率低下的不足，我們提齣瞭一種基于微米級垂直微陣列結構的新型晶圓傳輸麵設計方法，實驗錶明該方法有效提高瞭晶圓傳輸加速度，可顯著提高晶圓傳輸效率。針對大呎吋晶圓高效可靠傳輸過程中接觸信息檢測需求，我們提齣瞭一種新型的晶圓傳輸接觸麵微力與粘滑傳感器繫統方案，即利用壓敏導電墨（ PSCI ）的壓阻效應實現三維力測量以及利用電磁感應原理實現粘滑檢測，併通過實驗驗證瞭該方法的可行性。本文依次從問題提齣、國內外研究現狀分析、研究特色與實驗驗證等方麵分彆對上述3箇部分的研究內容進行瞭分析與闡述。最後，結閤上述分析，本文對現階段的研究成果進行瞭總結，併提齣瞭下一步的研究設想。
재초대규모집성전로（ IC）제조과정중，정원수요재수백도공예지간빈번전수，정원전수능력대정개IC산업적발전지관중요。정원전수궤기인시IC제조영역적관건설비지일，승담착정원정위여쾌속、평은반운임무。수착IC제조향착대척촌（직경≥300 mm ）정원여소선관（≤32 nm ）방향발전，정원생산선공서경집중，가공속도경쾌，공작배경경길정，저대정원전수궤기인성능제출료경고요구。위료실현대척촌초박정원적고효은정전수，아문종정원전수궤기인정학평은궤적근종공제、면향정원전수적미진열전수면설계이급접촉면미력여점활검측촉각전감기설계등3개방면개전료연구。침대현유정원전수궤기인양궤중각개운동관절불동보화말단수적진동문제，아문제출파교차우합공제기술화수입정형공제동시응용도평면관절형정원전수궤기인중，체도감소궤적근종시적륜곽오차화소제유성전동배절인기적말단집행기진동적목적，실현료궤기인정학평은궤적근종공제。침대목전철점지승식말단집행기전수정원시마찰계수교소、전수효솔저하적불족，아문제출료일충기우미미급수직미진렬결구적신형정원전수면설계방법，실험표명해방법유효제고료정원전수가속도，가현저제고정원전수효솔。침대대척촌정원고효가고전수과정중접촉신식검측수구，아문제출료일충신형적정원전수접촉면미력여점활전감기계통방안，즉이용압민도전묵（ PSCI ）적압조효응실현삼유력측량이급이용전자감응원리실현점활검측，병통과실험험증료해방법적가행성。본문의차종문제제출、국내외연구현상분석、연구특색여실험험증등방면분별대상술3개부분적연구내용진행료분석여천술。최후，결합상술분석，본문대현계단적연구성과진행료총결，병제출료하일보적연구설상。
In the manufacturing process of very-large-scale in-tegrated circuit ( VLSI ) , wafers are required to be transferred among hundreds of technological processes , therefore, the performance of wafer transfer is crucial to the development of the entire IC industry .As one of the essential equipment for IC manufacturing , the wafer transfer robot undertakes the important task of wafer po-sitioning and fast and steadily transferring . With IC manufacturing developing toward the large-size ( diame-ter ≥300mm) wafer and small feature size (line-width≤32nm) direction, the wafer production line becomes more compact, with higher processing speed in more cleaner environment , which requires the higher per-formance of wafer transfer robot .In order to realize effi-ciently and steadily wafer transfer with high-efficiency and stabilization , we have conducted three aspects of research, that is, the accurate and stable trajectory tracking control of wafer transfer robot , the development of micro-fiber array for wafer transfer and the develop-ment of tactile sensor for force measurement and stick-slip detection .According to the problem with movable joints of the wafer transfer robot prototype being out of sync and its end effecter existing vibration , the combi-nation of cross-coupled synchronized control framework and open-loop input shape regulation technology has been successfully adopted to reduce the contour of the robot system and suppress the vibration of the end-effec-tor .Considering the shortage of low frictional coefficient between current convex point supporting materials and the wafer , a novel wafer transfer surface with micro-fi-ber array has been developed to apparently improve the acceleration of wafer transfer and transferring efficiency . To meet the requirement of detecting the contact proper-ties during wafer transfer , a new tactile sensor , based on the piezo-resisitive effect of piezo-sensitive conduc-tive ink ( PSCI ) for measuring 3-D micro-force and the electromagnetic induction of the opposite motion be-tween an permanent magnet and chip inductors for de-tecting stick-slip, has been proposed and its feasibility has been verified by experiments .In this paper , we de-scribed above three parts in details one by one , from the raise of problem, the state-of-art, to our distinct solu-tion and validation .Finally, our research results are summarized based on above analysis and the further re-search is also presented .