CAJ | 학술논문

从Au纳米粒子出发，利用竖直浸渍提拉法（ dip-coating）成功将Au纳米粒子负载于基底（云母片/单晶硅片），并以3-氨丙基三甲氧基硅烷（ APTMS ）对单晶硅片进行改性，得到具有密度分布不同的 Au 纳米粒子 two dimensional （2D）组装结构，制备方法简单易行。利用原子力显微镜（AFM）表征了不同制备条件下Au纳米粒子在基底表面的分布状态，结果表明，Au纳米粒子溶胶和偶联剂APTMS的浓度以及浸渍时间对Au纳米粒子在单晶硅片表面的密度分布起到决定性作用。
종Au납미입자출발，이용수직침지제랍법（ dip-coating）성공장Au납미입자부재우기저（운모편/단정규편），병이3-안병기삼갑양기규완（ APTMS ）대단정규편진행개성，득도구유밀도분포불동적 Au 납미입자 two dimensional （2D）조장결구，제비방법간단역행。이용원자력현미경（AFM）표정료불동제비조건하Au납미입자재기저표면적분포상태，결과표명，Au납미입자용효화우련제APTMS적농도이급침지시간대Au납미입자재단정규편표면적밀도분포기도결정성작용。
Through the dip-coating mode, Au nanoparticles were deposited on the mica and 3-aminopropyltrimethoxysilane modified silicon wafer, forming Au nanopartilces 2D-assembled structures with different density distributions. The distribution of Au nanoparticles on the substrates was characterized by atomic force microscopy ( AFM) and the results showed that the concentrations of the Au nanoparticles sol and APTMS as well as the dipping time were the crucial factors to control the density distribution of Au nanoparticles on the silicon wafer.