燕山大学学报
燕山大學學報
연산대학학보
JOURNAL OF YANSHAN UNIVERSITY
2013年
5期
385-388,401
,共5页
王明家%马千%李景丽%张勇%王艳%陈雷
王明傢%馬韆%李景麗%張勇%王豔%陳雷
왕명가%마천%리경려%장용%왕염%진뢰
锻造316LN%热老化%位错组态%电阻率%显微硬度
鍛造316LN%熱老化%位錯組態%電阻率%顯微硬度
단조316LN%열노화%위착조태%전조솔%현미경도
forged 316LN%thermal aging%dislocation configuration%electrical resistivity%micro-hardness
研究了热老化对核级316LN锻造奥氏体不锈钢的位错组态、电阻率及显微硬度的影响规律。结果表明,随着热老化的进行,奥氏体基体中位错密度总体下降,而始于晶界向晶内延伸的扩展位错数量增多且宽度变窄,其中,固溶态的扩展位错宽度约为1.0 m,热老化5000 h后约为0.2 m。分析认为,碳原子在晶界及其附近微区的偏聚是引起位错亚结构变化的主要原因;电阻率随热老化时间的延长、检测温度的升高而增大,且热老化5000 h后电阻率随温度的增长速率高于固溶态;晶内和晶界处的显微硬度值随热老化的进行均有所升高,二者之间显微硬度的差值逐渐增加。
研究瞭熱老化對覈級316LN鍛造奧氏體不鏽鋼的位錯組態、電阻率及顯微硬度的影響規律。結果錶明,隨著熱老化的進行,奧氏體基體中位錯密度總體下降,而始于晶界嚮晶內延伸的擴展位錯數量增多且寬度變窄,其中,固溶態的擴展位錯寬度約為1.0 m,熱老化5000 h後約為0.2 m。分析認為,碳原子在晶界及其附近微區的偏聚是引起位錯亞結構變化的主要原因;電阻率隨熱老化時間的延長、檢測溫度的升高而增大,且熱老化5000 h後電阻率隨溫度的增長速率高于固溶態;晶內和晶界處的顯微硬度值隨熱老化的進行均有所升高,二者之間顯微硬度的差值逐漸增加。
연구료열노화대핵급316LN단조오씨체불수강적위착조태、전조솔급현미경도적영향규률。결과표명,수착열노화적진행,오씨체기체중위착밀도총체하강,이시우정계향정내연신적확전위착수량증다차관도변착,기중,고용태적확전위착관도약위1.0 m,열노화5000 h후약위0.2 m。분석인위,탄원자재정계급기부근미구적편취시인기위착아결구변화적주요원인;전조솔수열노화시간적연장、검측온도적승고이증대,차열노화5000 h후전조솔수온도적증장속솔고우고용태;정내화정계처적현미경도치수열노화적진행균유소승고,이자지간현미경도적차치축점증가。
The influence of the thermal aging on dislocation configuration, electrical resistivity and hardness of nuclear grade 316LN forged austenitic stainless steel is studied in this paper. The results show that, as the thermal aging proceeds, the total dis-location density in the austenite matrix decreases. The number of extended dislocations which begins at grain boundary and subse-quently extends to the intragranular is also found to increase with the reduction of the width of the extended dislocation. The dis-location width in the solid solutions is approximately 1.0 m, while after 5 000 h thermal aging the width decreases down to around 0.2 m. The segregation of carbon atoms in and near the grain boundaries might account for the change in dislocation structure. Electrical resistivity also increases with thermal aging time and temperature. After 5 000 h thermal aging the electrical resistivity with temperature increases more rapidly compared with that in the solute state. The micro-hardness of the structures located at in-tragranular and grain boundary is enhanced with thermal aging, however, the micro-hardness difference increases.