电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2013年
6期
367-370
,共4页
多层陶瓷电容器(MLCC)%生坯%研磨%分层
多層陶瓷電容器(MLCC)%生坯%研磨%分層
다층도자전용기(MLCC)%생배%연마%분층
MLCC (Multi-layer Chip Ceramic Capacitor)%Green chip%Tumbling%Delamination
采用新开发出的一种多层片式陶瓷电容器（MLCC）生坯研磨工艺，对现有MLCC加工流程再造，解决现有烧成后芯片研磨工艺对芯片造成内部损伤，导致MLCC芯片内部分层，保护层开裂及芯片棱角崩瓷等影响产品质量的问题，同时对MLCC的加工过程进行简化，缩短加工周期。
採用新開髮齣的一種多層片式陶瓷電容器（MLCC）生坯研磨工藝，對現有MLCC加工流程再造，解決現有燒成後芯片研磨工藝對芯片造成內部損傷，導緻MLCC芯片內部分層，保護層開裂及芯片稜角崩瓷等影響產品質量的問題，同時對MLCC的加工過程進行簡化，縮短加工週期。
채용신개발출적일충다층편식도자전용기（MLCC）생배연마공예，대현유MLCC가공류정재조，해결현유소성후심편연마공예대심편조성내부손상，도치MLCC심편내부분층，보호층개렬급심편릉각붕자등영향산품질량적문제，동시대MLCC적가공과정진행간화，축단가공주기。
New tumbling technique for MLCC green chips will help a lot on re-manufacturing the current MLCC processes, and solve problems affecting product quality, such as delamination inside the chips and cracks of the cover layer caused by the internal damage to fired chips after the tumbling process, and chipped out corners etc. The new tumbling techniques can simplify MLCC manufacturing processes, and shorten the processing cycle.
