电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2013年
6期
342-344,355
,共4页
Au-Al键合界面%电解质类污染物%电化学腐蚀
Au-Al鍵閤界麵%電解質類汙染物%電化學腐蝕
Au-Al건합계면%전해질류오염물%전화학부식
Au-Al bonding-interface%Electrolyte pollutant%Electrochemical corrosion
初步探讨了Au-Al键合界面处于电解质类污染物中发生的失效行为及其机理。分析认为电解质类污染物作用于Au-Al键合界面后，发生了电化学腐蚀反应而加速Au-Al键合提前失效。在实际生产中，实施多芯片组件组装、调试与检验全过程的质量过程控制以及确定多芯片组件合适的气密封指标可以有效排除外来污染物对Au-Al键合界面可靠性的不利影响。
初步探討瞭Au-Al鍵閤界麵處于電解質類汙染物中髮生的失效行為及其機理。分析認為電解質類汙染物作用于Au-Al鍵閤界麵後，髮生瞭電化學腐蝕反應而加速Au-Al鍵閤提前失效。在實際生產中，實施多芯片組件組裝、調試與檢驗全過程的質量過程控製以及確定多芯片組件閤適的氣密封指標可以有效排除外來汙染物對Au-Al鍵閤界麵可靠性的不利影響。
초보탐토료Au-Al건합계면처우전해질류오염물중발생적실효행위급기궤리。분석인위전해질류오염물작용우Au-Al건합계면후，발생료전화학부식반응이가속Au-Al건합제전실효。재실제생산중，실시다심편조건조장、조시여검험전과정적질량과정공제이급학정다심편조건합괄적기밀봉지표가이유효배제외래오염물대Au-Al건합계면가고성적불리영향。
The failure behavior and mechanism of Au-Al bonding-interface in the electrolyte pollutant is discussed. It was thought that when the electrolyte pollutant acted on the Au-Al bonding-interface, the electrochemical corrosion occurred to aggravate the failure of Au-Al bonding because of the large potential difference between Au and Al. In the manufacture of multi-chip module, the process control of the assembly, debugging and inspection was carried out;the hermetic packaging was required, the influence of the foreign pollutant effectively on the reliability of Au-Al bonding-interface can be eliminated.
