CAJ | 학술논문

随着电子产品无铅化的不断推进，在高可靠电子产品组装中，采用有铅焊料焊接有铅无铅镀层器件并存的情况不可避免。因此混合焊接工艺和焊点的可靠性是研究的重点。本文提出了有铅无铅高密度混装工艺研究方法，针对有铅无铅镀层兼容性、高密度混装再流焊工艺、及有铅无铅高密度混装焊点可靠性开展技术研究工作，并与同行业者分享阶段性研究成果。
수착전자산품무연화적불단추진，재고가고전자산품조장중，채용유연한료한접유연무연도층기건병존적정황불가피면。인차혼합한접공예화한점적가고성시연구적중점。본문제출료유연무연고밀도혼장공예연구방법，침대유연무연도층겸용성、고밀도혼장재류한공예、급유연무연고밀도혼장한점가고성개전기술연구공작，병여동행업자분향계단성연구성과。
With the development of lead-free electronic process, the mix alloy soldering of lead and lead-free components with SnPb paste is inevitable in high reliability electronic assembly. Research emphasis is placed on soldering process and reliability of mixed solder. Present series experiences on assembly technology of high-density printed wiring board with lead and lead-free components. The investigation includes compatibility of lead-free finishes with SnPb paste, reflow soldering process of mixed assembly and reliability of mixed solders. The main experimental results are given.