电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2013年
6期
328-332,366
,共6页
张玮%蒋庆磊%严伟%刘刚%王旭艳
張瑋%蔣慶磊%嚴偉%劉剛%王旭豔
장위%장경뢰%엄위%류강%왕욱염
有铅%无铅%有铅无铅混装%金属间化合物%可靠性
有鉛%無鉛%有鉛無鉛混裝%金屬間化閤物%可靠性
유연%무연%유연무연혼장%금속간화합물%가고성
Lead%Lead-free%Mixed assembly%Intermetallics%Reliability
随着电子产品无铅化的不断推进,在高可靠电子产品组装中,采用有铅焊料焊接有铅无铅镀层器件并存的情况不可避免。因此混合焊接工艺和焊点的可靠性是研究的重点。本文提出了有铅无铅高密度混装工艺研究方法,针对有铅无铅镀层兼容性、高密度混装再流焊工艺、及有铅无铅高密度混装焊点可靠性开展技术研究工作,并与同行业者分享阶段性研究成果。
隨著電子產品無鉛化的不斷推進,在高可靠電子產品組裝中,採用有鉛銲料銲接有鉛無鉛鍍層器件併存的情況不可避免。因此混閤銲接工藝和銲點的可靠性是研究的重點。本文提齣瞭有鉛無鉛高密度混裝工藝研究方法,針對有鉛無鉛鍍層兼容性、高密度混裝再流銲工藝、及有鉛無鉛高密度混裝銲點可靠性開展技術研究工作,併與同行業者分享階段性研究成果。
수착전자산품무연화적불단추진,재고가고전자산품조장중,채용유연한료한접유연무연도층기건병존적정황불가피면。인차혼합한접공예화한점적가고성시연구적중점。본문제출료유연무연고밀도혼장공예연구방법,침대유연무연도층겸용성、고밀도혼장재류한공예、급유연무연고밀도혼장한점가고성개전기술연구공작,병여동행업자분향계단성연구성과。
With the development of lead-free electronic process, the mix alloy soldering of lead and lead-free components with SnPb paste is inevitable in high reliability electronic assembly. Research emphasis is placed on soldering process and reliability of mixed solder. Present series experiences on assembly technology of high-density printed wiring board with lead and lead-free components. The investigation includes compatibility of lead-free finishes with SnPb paste, reflow soldering process of mixed assembly and reliability of mixed solders. The main experimental results are given.