CAJ | 학술논문

利用ANSYS对Mosfet功率管和散热片的接触热阻进行有限元分析，提出了一种表面粗糙度的模拟方法，对接触热阻的主要影响因素-表面粗糙度进行了深入的仿真分析研究，得出了接触热阻与粗糙度各因素的关系，并对其他影响接触热阻的因素进行了分析。
이용ANSYS대Mosfet공솔관화산열편적접촉열조진행유한원분석，제출료일충표면조조도적모의방법，대접촉열조적주요영향인소-표면조조도진행료심입적방진분석연구，득출료접촉열조여조조도각인소적관계，병대기타영향접촉열조적인소진행료분석。
Finite element analysis is established on the thermal contact resistance between power Mosfet and heat-sink. A method is put forward to make a simulation of surface asperities and further research on the main factor of thermal contact resistance is carried in this paper. A relationship between thermal contact resistance and surface as-perities is attained. The other factors on thermal contact resistance are also analysed. This method saves design cost and has certain guiding significance on Mosfet and heatsink design.