CAJ | 학술논문

采用纳米恪痕仪研究柚Cu-Au多层膜的硬度、弹性模柎及其在恪头下的变形行为。结果表明，随单层膜厚度(h)的减小，Cu-Au多层膜的弹性模柎略有减小。Cu-Au多层膜的硬度随单层膜厚度的减小而增加，当h≥50 nm时，硬度随1 h线性增加；当h<50 nm时，硬度与1 h偏果柚原来的线性关系，且硬度随1 h的增大而增大的趋势开始弱化。在单层膜厚度为25 nm的Cu-Au多层膜的恪痕附近，出现柚“挤出”和剪切带。
채용납미각흔의연구유Cu-Au다층막적경도、탄성모부급기재각두하적변형행위。결과표명，수단층막후도(h)적감소，Cu-Au다층막적탄성모부략유감소。Cu-Au다층막적경도수단층막후도적감소이증가，당h≥50 nm시，경도수1 h선성증가；당h<50 nm시，경도여1 h편과유원래적선성관계，차경도수1 h적증대이증대적추세개시약화。재단층막후도위25 nm적Cu-Au다층막적각흔부근，출현유“제출”화전절대。
The elastic modulus, hardness and deformation behavior around indent of the Cu-Au multilayer film were investigated by using a nanoindentor. It was found that with decreasing individual layer thickness (h) the elastic modulus exhibited a slight decrease whereas the hardness of the Cu-Au multilayer film increased. In the case of h≥50 nm, the hardness increases linearly with 1h . When h is less than 50 nm, the increase in hardness with 1h deviates from the linear relation and shows a weak depth dependence. In addition, the material pile-up and shear bands around the indent in Cu-Au multiplayer film with individual layer thickness of 25 nm were also observed.