红外与激光工程
紅外與激光工程
홍외여격광공정
INFRARED AND LASER ENGINEERING
2013年
12期
3254-3258
,共5页
孙旭飞%岳阳%杜惊雷%张志友
孫旭飛%嶽暘%杜驚雷%張誌友
손욱비%악양%두량뢰%장지우
SPP直写光刻%直写头%SPP谐振腔
SPP直寫光刻%直寫頭%SPP諧振腔
SPP직사광각%직사두%SPP해진강
SPP direct-writing lithography%direct-writing head%SPP coupling cavity
设计了一种新的具有高曝光深度的纳米光刻直写头,它由用薄银层制得的V型孔、匹配液和有机固化层组成。 V型孔被用来聚焦入射光束于200 nm的光斑中。直写头通过匹配液在光刻胶上移动,而匹配液与石英基底相结合,构成了表面等离激元(SPP)谐振腔,由传播波及反射波形成的驻波的传播深度将达到几百纳米。模拟证明了新的直写头可通过F-P效应及SPP多次激发增强方式实现在光刻胶中深度曝光,当直写头与光刻胶的间距大于90 nm时,不仅可避免光刻胶和直写头的相对磨损,也有助于降低机械移动工艺的要求,因此在纳米掩模板和纳米光子器件的制备上有较高实际应用的可能性。
設計瞭一種新的具有高曝光深度的納米光刻直寫頭,它由用薄銀層製得的V型孔、匹配液和有機固化層組成。 V型孔被用來聚焦入射光束于200 nm的光斑中。直寫頭通過匹配液在光刻膠上移動,而匹配液與石英基底相結閤,構成瞭錶麵等離激元(SPP)諧振腔,由傳播波及反射波形成的駐波的傳播深度將達到幾百納米。模擬證明瞭新的直寫頭可通過F-P效應及SPP多次激髮增彊方式實現在光刻膠中深度曝光,噹直寫頭與光刻膠的間距大于90 nm時,不僅可避免光刻膠和直寫頭的相對磨損,也有助于降低機械移動工藝的要求,因此在納米掩模闆和納米光子器件的製備上有較高實際應用的可能性。
설계료일충신적구유고폭광심도적납미광각직사두,타유용박은층제득적V형공、필배액화유궤고화층조성。 V형공피용래취초입사광속우200 nm적광반중。직사두통과필배액재광각효상이동,이필배액여석영기저상결합,구성료표면등리격원(SPP)해진강,유전파파급반사파형성적주파적전파심도장체도궤백납미。모의증명료신적직사두가통과F-P효응급SPP다차격발증강방식실현재광각효중심도폭광,당직사두여광각효적간거대우90 nm시,불부가피면광각효화직사두적상대마손,야유조우강저궤계이동공예적요구,인차재납미엄모판화납미광자기건적제비상유교고실제응용적가능성。
A new direct writing device was designed. It consisted of a V-shaped hole made by Ag, the matching fluid and the organic layer for high exposure depth. 200 nm light spots were obtained by V-shaped hole which focued the incident light beams. Direct-writing head moved onto the photoresist through the matching fluid, and the matching fluid combined with the quartz substrate constructed a surface plasmon polariton (SPP) coupling cavity, which amplified the intensity of the light field in it by SPP effect and resonance. The transmission depth of the standing wave formed by forward and reflected light reached hundreds of nanometers. Simulation results show that using the new direct-write head can achieve deep exposure depth in the resist by F-P effect and SPP effect (multiple excitations). When the distance between the direct-write head and resist is greater than 90 nm, it can not only avoid the relative wear between the direct-write head and resist, but also help reduce the requirement of the mechanical movement process . Therefore it has high application potential in fabrication of nano-mask and nanophotonic structures.