材料研究与应用
材料研究與應用
재료연구여응용
MATERIALS RESEARCH AND APPLICATION
2014年
3期
182-185
,共4页
许毅钦%李炳乾%赵维%张康%焦飞华%古志良%苏海常
許毅欽%李炳乾%趙維%張康%焦飛華%古誌良%囌海常
허의흠%리병건%조유%장강%초비화%고지량%소해상
集成封装%高压线性恒流%COB模组
集成封裝%高壓線性恆流%COB模組
집성봉장%고압선성항류%COB모조
integrated encapsulation%high voltage and linear constant current%COB module
本文开发设计了一种基于高压线性恒流技术的COB模组,结合高压线性恒流芯片和蓝光LED高压芯片,采用去电解电容技术,将H V-L ED芯片及高压线性恒流IC、整流桥等电子元件集成封装在陶瓷基板上,并通过实验研究了固晶胶对COB模组光通量的影响。研究结果表明,采用高压线性恒流技术一体化封装的COB光源,具有体积小、使用方便等优势,是未来室内照明光源的发展趋势。
本文開髮設計瞭一種基于高壓線性恆流技術的COB模組,結閤高壓線性恆流芯片和藍光LED高壓芯片,採用去電解電容技術,將H V-L ED芯片及高壓線性恆流IC、整流橋等電子元件集成封裝在陶瓷基闆上,併通過實驗研究瞭固晶膠對COB模組光通量的影響。研究結果錶明,採用高壓線性恆流技術一體化封裝的COB光源,具有體積小、使用方便等優勢,是未來室內照明光源的髮展趨勢。
본문개발설계료일충기우고압선성항류기술적COB모조,결합고압선성항류심편화람광LED고압심편,채용거전해전용기술,장H V-L ED심편급고압선성항류IC、정류교등전자원건집성봉장재도자기판상,병통과실험연구료고정효대COB모조광통량적영향。연구결과표명,채용고압선성항류기술일체화봉장적COB광원,구유체적소、사용방편등우세,시미래실내조명광원적발전추세。
In this work ,a novel COB (chip on board) module based on high voltage ,linear constant current technology was designed .The electronic components ,such as HV-LED chips ,high voltage ,linear con-stant current IC ,and rectifier bridge etc ,were encapsulated on ceramic substrate without any electrolytic capacitor .The influence of die attach adhesive on luminous flux of COB module by experiment was investi-gated .The results show that the COB module based on high-voltage ,linear constant current technology with the advantages of small volume ,ease to use and so on ,is the trend of the indoor lighting light source in the future .