红外与激光工程
紅外與激光工程
홍외여격광공정
INFRARED AND LASER ENGINEERING
2014年
5期
1473-1476
,共4页
王宏杰%高金富%高扬%董玥%吕福云
王宏傑%高金富%高颺%董玥%呂福雲
왕굉걸%고금부%고양%동모%려복운
激光加工%光泽金属%高亮度
激光加工%光澤金屬%高亮度
격광가공%광택금속%고량도
laser processing%shine metal%high brightness
采用266 nm或355 nm的紫外激光器可以对微小的金属薄膜器件直接进行激光精密加工。但是,目前紫外激光器的输出功率普遍较低,以至于还不能对大幅面、深尺度的光泽金属进行激光加工。为了克服光泽金属对大功率固体激光器输出的1064 nm激光的高反射率和散热快问题,采用了优化谐振腔和扫描聚焦系统的光学方法,实现了激光单模运转,功率密度达到了1.592×109 W/cm2,由此也使得加工工件通过原子吸收激光能量的方式改变为通过金属中的自由电子的等离子体激射来吸收激光能量。在平均功率为50 W、重复频率为500 Hz、焦斑直径小于20μm、脉冲宽度为80 ns、切割速度为10 mm/s的加工条件下,对厚度为10 mm的大尺寸紫铜板直接进行了激光精密刻蚀实验,切割的槽宽和槽深均为100±10μm;槽间距为300±15μm,均达到了初始设计的指标要求。
採用266 nm或355 nm的紫外激光器可以對微小的金屬薄膜器件直接進行激光精密加工。但是,目前紫外激光器的輸齣功率普遍較低,以至于還不能對大幅麵、深呎度的光澤金屬進行激光加工。為瞭剋服光澤金屬對大功率固體激光器輸齣的1064 nm激光的高反射率和散熱快問題,採用瞭優化諧振腔和掃描聚焦繫統的光學方法,實現瞭激光單模運轉,功率密度達到瞭1.592×109 W/cm2,由此也使得加工工件通過原子吸收激光能量的方式改變為通過金屬中的自由電子的等離子體激射來吸收激光能量。在平均功率為50 W、重複頻率為500 Hz、焦斑直徑小于20μm、脈遲寬度為80 ns、切割速度為10 mm/s的加工條件下,對厚度為10 mm的大呎吋紫銅闆直接進行瞭激光精密刻蝕實驗,切割的槽寬和槽深均為100±10μm;槽間距為300±15μm,均達到瞭初始設計的指標要求。
채용266 nm혹355 nm적자외격광기가이대미소적금속박막기건직접진행격광정밀가공。단시,목전자외격광기적수출공솔보편교저,이지우환불능대대폭면、심척도적광택금속진행격광가공。위료극복광택금속대대공솔고체격광기수출적1064 nm격광적고반사솔화산열쾌문제,채용료우화해진강화소묘취초계통적광학방법,실현료격광단모운전,공솔밀도체도료1.592×109 W/cm2,유차야사득가공공건통과원자흡수격광능량적방식개변위통과금속중적자유전자적등리자체격사래흡수격광능량。재평균공솔위50 W、중복빈솔위500 Hz、초반직경소우20μm、맥충관도위80 ns、절할속도위10 mm/s적가공조건하,대후도위10 mm적대척촌자동판직접진행료격광정밀각식실험,절할적조관화조심균위100±10μm;조간거위300±15μm,균체도료초시설계적지표요구。
Micro devices of metal thin film may be directly processed by utilizing the UV laser at the wavelegth of 266 nm or 355 nm. However, due to the output power of UV laser is common lower at present, it is not suitable for directly processing the shine metal with the larger size and thick. In this experiment, in order to overcome the problems that shine metal possess the high reflectivity to the solid state laser of high power at 1 064 nm and the fast heat dissipation, the resonant cavity and the scanning focusing system were optimized, then the laser single mode operation was realized and the power density was reached 1.592í109 W/cm2, which also make that the absorption of laser energy by atom changes into the absorption way by the plasma emission of the free electrons in the metal. Utlizing to the laser of average power of 50 W, repetition frequency of 500 Hz, spot diameter of 20μm, pulse duration of 80 ns, cutting velocity of 10 mm/s, the bigger copperplate with thick of 10 mm was directly processed accurately, the width and deepth of the groove by laser cutting were all 100±10μm, and the groove spacing was 300±15μm, that were enough satisfied the initial target.