CAJ | 학술논문

论述了印刷电路板(printed circuit board, PCB)用硬质合金微钻材料的发展历程,并重点阐述了微钻材料制备工艺,包括原材料工艺、挤出成型工艺、烧结工艺、热等静压工艺和表面强化工艺的发展状况。提出我国重点在挤压流变学基础理论研究、新成型剂体系开发、成型工艺、设备配套技术和微钻涂层研究方面,应做出更大的努力,从而生产出性能优异、用于高技术产业中的硬质合金微钻材料。
논술료인쇄전로판(printed circuit board, PCB)용경질합금미찬재료적발전역정,병중점천술료미찬재료제비공예,포괄원재료공예、제출성형공예、소결공예、열등정압공예화표면강화공예적발전상황。제출아국중점재제압류변학기출이론연구、신성형제체계개발、성형공예、설비배투기술화미찬도층연구방면,응주출경대적노력,종이생산출성능우이、용우고기술산업중적경질합금미찬재료。
More printed circuit boards (PCB)would be produced with the development of electronic industry. And more microdrills for PCB woluld be needed.This paper describes the development of microdrill material. And the development of the manufacturing technique was discussed in details.Our country should do more work on the study of the rheology of powder extrusion,new formagen,forming process,coating technology and equipment matching technology.