电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2014年
1期
1-5
,共5页
微波多芯片组件%微量导电胶%自动分配
微波多芯片組件%微量導電膠%自動分配
미파다심편조건%미량도전효%자동분배
microwave multi-chip module%traceconductive adhesive%automatic distribute
文章首先介绍了微波多芯片组件两种常见的封装结构形式及导电胶自动分配技术需求，并对接触式和无接触式导电胶点胶技术进行了论述，分析了它们各自的优缺点并对各项点胶参数进行了对比。然后，阐述了计量管式接触点胶技术以及需要研究的针头漏胶、点胶间隙确定以及基板表面状态对胶滴的影响三方面内容。紧接着阐述喷射式非接触点胶技术以及需要研究的空气阻力造成的胶滴飞溅问题。最后，提出计量管式接触点胶技术最适合腔体结构微波多芯片组件自动点胶。
文章首先介紹瞭微波多芯片組件兩種常見的封裝結構形式及導電膠自動分配技術需求，併對接觸式和無接觸式導電膠點膠技術進行瞭論述，分析瞭它們各自的優缺點併對各項點膠參數進行瞭對比。然後，闡述瞭計量管式接觸點膠技術以及需要研究的針頭漏膠、點膠間隙確定以及基闆錶麵狀態對膠滴的影響三方麵內容。緊接著闡述噴射式非接觸點膠技術以及需要研究的空氣阻力造成的膠滴飛濺問題。最後，提齣計量管式接觸點膠技術最適閤腔體結構微波多芯片組件自動點膠。
문장수선개소료미파다심편조건량충상견적봉장결구형식급도전효자동분배기술수구，병대접촉식화무접촉식도전효점효기술진행료논술，분석료타문각자적우결점병대각항점효삼수진행료대비。연후，천술료계량관식접촉점효기술이급수요연구적침두루효、점효간극학정이급기판표면상태대효적적영향삼방면내용。긴접착천술분사식비접촉점효기술이급수요연구적공기조력조성적효적비천문제。최후，제출계량관식접촉점효기술최괄합강체결구미파다심편조건자동점효。
First introduced two common microwave multi-chip module package structure and the need of automatically assigned conductive adhesive technology, then discussed both of contact and non-contact dispensing conductive adhesive technology, and compared their advantages and disadvantages of the various points dispensing parameters. Then expounded metering tube in contact dispensing technology and the need to study three aspects of the needle leak adhesive, dispensing gap identiifed, and the substrate surface state influence on the gum drops, followed by elaborate non-contact jet dispensing technology and the need to study the air resistance caused by gum drops spattering. Finally, metered dispensing tube automatically dispensing is the best way for cavity structure microwave multi-chip module.
