电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2014年
2期
5-8,15
,共5页
微电子封装%微波等离子清洗%可靠性
微電子封裝%微波等離子清洗%可靠性
미전자봉장%미파등리자청세%가고성
microelectronics packaging%microwave plasma cleaning%reliability
微电子封装过程中产生的沾污严重影响了电子元器件的可靠性和使用寿命。文中研究了用微波等离子清洗封装过程中产生的沾污。研究结果表明，微波等离子清洗能有效增强基板的浸润性，降低芯片和基板共晶焊界面的孔隙率，同时也能清除元件表面的氧化物薄膜和有机物沾污，经过等离子清洗，其键合焊接强度和合金熔封密封性都得到提高。
微電子封裝過程中產生的霑汙嚴重影響瞭電子元器件的可靠性和使用壽命。文中研究瞭用微波等離子清洗封裝過程中產生的霑汙。研究結果錶明，微波等離子清洗能有效增彊基闆的浸潤性，降低芯片和基闆共晶銲界麵的孔隙率，同時也能清除元件錶麵的氧化物薄膜和有機物霑汙，經過等離子清洗，其鍵閤銲接彊度和閤金鎔封密封性都得到提高。
미전자봉장과정중산생적첨오엄중영향료전자원기건적가고성화사용수명。문중연구료용미파등리자청세봉장과정중산생적첨오。연구결과표명，미파등리자청세능유효증강기판적침윤성，강저심편화기판공정한계면적공극솔，동시야능청제원건표면적양화물박막화유궤물첨오，경과등리자청세，기건합한접강도화합금용봉밀봉성도득도제고。
The reliability and lifetime of electronic component is seriously affected by contamination in the process of assembly. In this paper, the method of microwave plasma cleaning for decontamination has been studied. The results showed that this method could enhance the wettability of substrate and reduce alloy soldering void ratio at the interface between die and substrate, and also could remove the thin oxide films and organic contamination at surfaces. Furthermore, wire bonding strength and alloy sealing hermeticity could be improved by this method.
