电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2014年
2期
1-4
,共4页
丁荣峥%马国荣%史丽英%李杰%张军峰
丁榮崢%馬國榮%史麗英%李傑%張軍峰
정영쟁%마국영%사려영%리걸%장군봉
盖板%密封%合金焊料
蓋闆%密封%閤金銲料
개판%밀봉%합금한료
frames-lids-preforms%solder%seal
在平行缝焊、储能焊、玻璃熔封、激光焊、合金焊料熔封等密封工艺中，合金焊料密封是高可靠密封的优选工艺。文章针对合金焊料密封工艺中常遇到的密封强度、密封内部气氛、焊缝及盖板耐腐蚀、薄形封装易短路等问题，介绍了通过合金焊料盖板的选择，从而控制密封强度、密封内部气氛、耐蚀性能和电性能等的质量。
在平行縫銲、儲能銲、玻璃鎔封、激光銲、閤金銲料鎔封等密封工藝中，閤金銲料密封是高可靠密封的優選工藝。文章針對閤金銲料密封工藝中常遇到的密封彊度、密封內部氣氛、銲縫及蓋闆耐腐蝕、薄形封裝易短路等問題，介紹瞭通過閤金銲料蓋闆的選擇，從而控製密封彊度、密封內部氣氛、耐蝕性能和電性能等的質量。
재평행봉한、저능한、파리용봉、격광한、합금한료용봉등밀봉공예중，합금한료밀봉시고가고밀봉적우선공예。문장침대합금한료밀봉공예중상우도적밀봉강도、밀봉내부기분、한봉급개판내부식、박형봉장역단로등문제，개소료통과합금한료개판적선택，종이공제밀봉강도、밀봉내부기분、내식성능화전성능등적질량。
In parallel to the seam welding, energy storage welding, low temperature glass seal, laser welding, solder alloy melt sealing process, the solder alloy is highly reliable sealing sealing preferred way. This paper focuses on the strength of the alloy solder seal, the internal atmosphere, corrosion-resistant, ultra-thin package easy to short-circuit problem. Introduces the solder alloy frames-lids-preforms selection to control the seal strength, the internal atmosphere, corrosion and electrical properties and other quality.
