电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2014年
2期
13-15
,共3页
自动金丝球焊%成球缺陷%线夹
自動金絲毬銲%成毬缺陷%線夾
자동금사구한%성구결함%선협
automatic gold ball bonding%bonding defects%wire clamps
引线键合在多芯片微波组件微组装上应用广泛，通常会用金丝实现芯片与基板、基板与基板间的互连。自动金丝球焊是互连方法的一种，它具有生产效率高、一致性好的特点。文章针对在生产过程中出现的第一键合点成球缺陷展开原因分析，即键合工艺参数不当、真空系统故障和线夹间距不当等。系列试验验证，线夹间隙不当可造成上述缺陷，解决该问题的办法是将线夹间隙调整到0.05 mm。
引線鍵閤在多芯片微波組件微組裝上應用廣汎，通常會用金絲實現芯片與基闆、基闆與基闆間的互連。自動金絲毬銲是互連方法的一種，它具有生產效率高、一緻性好的特點。文章針對在生產過程中齣現的第一鍵閤點成毬缺陷展開原因分析，即鍵閤工藝參數不噹、真空繫統故障和線夾間距不噹等。繫列試驗驗證，線夾間隙不噹可造成上述缺陷，解決該問題的辦法是將線夾間隙調整到0.05 mm。
인선건합재다심편미파조건미조장상응용엄범，통상회용금사실현심편여기판、기판여기판간적호련。자동금사구한시호련방법적일충，타구유생산효솔고、일치성호적특점。문장침대재생산과정중출현적제일건합점성구결함전개원인분석，즉건합공예삼수불당、진공계통고장화선협간거불당등。계렬시험험증，선협간극불당가조성상술결함，해결해문제적판법시장선협간극조정도0.05 mm。
Wire bonding process is widely used in microwave multi-chip module for joining chip to substrate or substrate to substrate with gold wire. As one of connecting methods, automatic gold ball bonding has high production efficiency and good consensus. In order to solve first bonding defects in automatic gold ball bonding, this article expands the reason analysis, which includes the wrong settings of bolding parameters, failure of vacuum system, false space between wire clamps. Series experiments indicate that false space between wire clamps may cause the defects. Adjusting the space to 0.05 mm is a good way to solve this problem.
