CAJ | 학술논문

金刚石/铜复合材料具有高的热导率和可调的热膨胀系数，是一种极具竞争力的新型电子封装材料，可作为散热材料广泛应用于高功率、高封装密度的器件中。文中从工程化的角度出发，对应用中的瓶颈因素进行了研究。为改善其钎焊性能，采用磁控溅射、电镀等方法在金刚石/铜表面获得了附着力、可焊性良好的Ti-Cu-Ni-Au复合膜层。在此基础上进行了钎焊试验，金锡焊料在复合膜层上铺展良好、无虚焊。对金刚石/铜的散热效果与钼铜片做了对比试验，结果表明，在相同条件下，与钼铜热沉片相比，降温幅度超过20℃，具有更优异的散热效果。
금강석/동복합재료구유고적열도솔화가조적열팽창계수，시일충겁구경쟁력적신형전자봉장재료，가작위산열재료엄범응용우고공솔、고봉장밀도적기건중。문중종공정화적각도출발，대응용중적병경인소진행료연구。위개선기천한성능，채용자공천사、전도등방법재금강석/동표면획득료부착력、가한성량호적Ti-Cu-Ni-Au복합막층。재차기출상진행료천한시험，금석한료재복합막층상포전량호、무허한。대금강석/동적산열효과여목동편주료대비시험，결과표명，재상동조건하，여목동열침편상비，강온폭도초과20℃，구유경우이적산열효과。
As a new generation of electronic packaging material, Diamond/Cu composites have excellent performances such as high thermal conductivity and adjustable CTE.The bottle-neck factors in the application were studied in this paper. In order to improve the solder ability, Ti-Cu-Ni-Au compound-plating on Diamond/Cu was produced by PVD and ECD, the compound-plating has good adhesion strength and solder ability. Furthermore, compound-plating has good wettability with Au80Sn20. The result show that, Diamond/Cu has more excellent effectiveness of heat-emission on the same condition, which the temperature fall reach 20℃compare to MoCu.