CAJ | 학술논문

IC测试是集成电路生产中的重要工序，探针表面诸如划痕、凹坑等缺陷对性能测试结果影响大.文章研究了IC探针表面质量的机器视觉检测方法，讨论了灰度变换、均值滤波、区域连通、图像分割等缺陷图像处理和形状识别方法，建立了相应的探针表面质量检测系统，并基于机器视觉软件Halcon开发了探针表面质量检测系统软件.实验表明：开发的检测系统可对直径0.3~0.6 mm的IC测试探针表面质量进行快速检测评估，且系统的稳定性好、检测精度高，能有效缩短检测时间和减少检测成本.
IC측시시집성전로생산중적중요공서，탐침표면제여화흔、요갱등결함대성능측시결과영향대.문장연구료IC탐침표면질량적궤기시각검측방법，토론료회도변환、균치려파、구역련통、도상분할등결함도상처리화형상식별방법，건립료상응적탐침표면질량검측계통，병기우궤기시각연건Halcon개발료탐침표면질량검측계통연건.실험표명：개발적검측계통가대직경0.3~0.6 mm적IC측시탐침표면질량진행쾌속검측평고，차계통적은정성호、검측정도고，능유효축단검측시간화감소검측성본.
IC detection is an important step in the IC manufacture. The defects of IC probe surface, such as the abrasion and dent, deeply effect on the performance detection result. In this paper, the probe surface quality inspection method by the machine vision is studied, the defect image process and shape recognization method are discussed with the gray transform, mean filtering, region link and image segmentation. The surface quality inspection system is developed by means of Halcon software. It is satisfactory that the fast and accurate detection of the IC detection probe with its diameter of 0.3~0.6 mm and the detection cycle and low cost.