CAJ | 학술논문

LTCC技术作为高密度互连技术在电子产品中已得到广泛应用。而在微波高频电路中由于其印刷精度的限制一定程度上影响了电气性能。在LTCC上制作薄膜电路可以显著提高微带线精度及微波传输性能，同时提高微波产品集成密度，简化微组装工作步骤。通过工艺实验，分析和突破了LTCC-D工艺中的多项关键技术，形成了完整的工艺流程。该流程经样品和试生产验证达到了工程化应用水平。
LTCC기술작위고밀도호련기술재전자산품중이득도엄범응용。이재미파고빈전로중유우기인쇄정도적한제일정정도상영향료전기성능。재LTCC상제작박막전로가이현저제고미대선정도급미파전수성능，동시제고미파산품집성밀도，간화미조장공작보취。통과공예실험，분석화돌파료LTCC-D공예중적다항관건기술，형성료완정적공예류정。해류정경양품화시생산험증체도료공정화응용수평。
LTCC technology is widely used in electric production due to its high density of interconnection. But the low precision of printing influences the performance of microwave circuit. The technology of thin film on LTCC may improve the precision of strip and optimize the performance of transmission. This technology will increase the integration of production, and predigest the process of assembly. The key technology of thin film on LTCC is analyzed based on experiment, and the whole manufacture flow is given. The capability of technical application is proved in the sample and test yield.