CAJ | 학술논문

军用和民用微型电子产品的MCM、HIC等复杂混合电路正在越来越多地采用裸芯片，然而，裸芯片由于尺寸小、电路密集、焊盘间距小等原因，在进行组装的过程中一旦有微量的污染物出现，就会对裸芯片的应用造成较大影响。气相清洗通过清洗溶剂蒸汽在组件表面冷凝，形成液体滴下带走污染物，避免了传统的通过机械力、超声振动等清洗方式对裸芯片造成的不可修复的损伤。对限幅二极管砷化镓裸芯片、硅基裸芯片进行气相清洗，有效除去裸芯片表面的污染物，具有无损高效的特点。
군용화민용미형전자산품적MCM、HIC등복잡혼합전로정재월래월다지채용라심편，연이，라심편유우척촌소、전로밀집、한반간거소등원인，재진행조장적과정중일단유미량적오염물출현，취회대라심편적응용조성교대영향。기상청세통과청세용제증기재조건표면냉응，형성액체적하대주오염물，피면료전통적통과궤계력、초성진동등청세방식대라심편조성적불가수복적손상。대한폭이겁관신화가라심편、규기라심편진행기상청세，유효제거라심편표면적오염물，구유무손고효적특점。
Military and consumer electronic product makes bare chips more and more directly apply to MCM, HIC and other complex mixing circuit. However, because of the small size and tight pitch of bare chip, the contaminants on bare chip from the process of mounted and rework process has great influence on circuit performance, and must be removed. Vapor cleaning let solvent rise in a vapor state, and return to liquid when it encounters a cold module, discharge the contaminants, make bare chip avoid the irreparable damage caused by mechanical force, ultrasonic vibration cleaning methods. Vapor cleaning which was used to Si and GaAs chips can effectively and non-destructively remove contaminants on bare chip surface.