CAJ | 학술논문

射频识别（RFID）标签的封装中，芯片与天线靠各向异性导电胶（ACA）连接。ACA的性质导致了芯片的引脚与天线连接处会有较大的阻抗，影响了标签的电参数，会对标签读写距离产生不利的影响。分析了芯片引脚处阻抗对标签的电性能的影响，对该处电阻与寄生电容进行了建模和计算。最后，依据理论计算了一款天线的引脚阻抗，并据此对该天线进行了优化与测试，验证了理论的正确性。
사빈식별（RFID）표첨적봉장중，심편여천선고각향이성도전효（ACA）련접。ACA적성질도치료심편적인각여천선련접처회유교대적조항，영향료표첨적전삼수，회대표첨독사거리산생불리적영향。분석료심편인각처조항대표첨적전성능적영향，대해처전조여기생전용진행료건모화계산。최후，의거이론계산료일관천선적인각조항，병거차대해천선진행료우화여측시，험증료이론적정학성。
In the packaging of radio frequency identification (RFID) tags, IC and antenna are interconnected with anisotropic conductive adhesive (ACA), the property of ACA will led to a impedance at the pins of IC, and will affect the electrical parameters of the tag, which adversely affect the reading distance of tags. Analyzed how pin impedance affect the electrical properties of RFID tags, theoretically explained how the resistance and parasitic capacitance formed, and how can they be calculated. Finally, based on the theory calculated and optimized an antenna, the test results have verified the correctness of the theory.