CAJ | 학술논문

文章主要简述了PCB的 BGA位置一种无连接盘（孔环）孔生产制作方法，通过调整照片的补偿，制作出一种单边无孔环的孔，使得在BGA的设计上孔到孔，线到孔，连接盘到孔的距离越来越小，实现一种密集度更高，同时可以保证可靠性的BGA设计。
문장주요간술료PCB적 BGA위치일충무련접반（공배）공생산제작방법，통과조정조편적보상，제작출일충단변무공배적공，사득재BGA적설계상공도공，선도공，련접반도공적거리월래월소，실현일충밀집도경고，동시가이보증가고성적BGA설계。
This article mainly describes the PCB BGA location a hole without a RING production method, by adjusting the compensation iflm to produce a kind of unilateral no grommet holes. It is made on the design of the BGA hole to hole, line to the hole, with PAD to the hole distance is smaller and smaller. This can achieve a higher intensity, at the same time it can guarantee the reliability of the design of BGA.