电子工业专用设备
電子工業專用設備
전자공업전용설비
EQUIPMENT FOR ELECTRONIC PRODUCTS MANUFACTURING
2014年
3期
33-36,60
,共5页
化学机械平坦化%集成技术%多区域压力控制%终点检测%抛光垫修整%后清洗
化學機械平坦化%集成技術%多區域壓力控製%終點檢測%拋光墊脩整%後清洗
화학궤계평탄화%집성기술%다구역압력공제%종점검측%포광점수정%후청세
Chemical mechanical planarization (CMP)%System integrated%Multi-zone back pressure control%Endpoint detection%Pad conditioner%Post CMP cleaning
分析化学机械平坦化（CMP）耗材发展现状及趋势，推断450 mm晶圆的CMP设备及技术的迫切性；在此基础上，展望450 mm晶圆将会采用系统集成技术、多区域压力控制承载器技术、抛光垫修整技术、终点检测技术、后清洗技术，并初步分析以上这些技术的特点。最后指出随着晶圆制造厂激烈竞争和持续投资，对450 mm的CMP设备要求必有所突破。
分析化學機械平坦化（CMP）耗材髮展現狀及趨勢，推斷450 mm晶圓的CMP設備及技術的迫切性；在此基礎上，展望450 mm晶圓將會採用繫統集成技術、多區域壓力控製承載器技術、拋光墊脩整技術、終點檢測技術、後清洗技術，併初步分析以上這些技術的特點。最後指齣隨著晶圓製造廠激烈競爭和持續投資，對450 mm的CMP設備要求必有所突破。
분석화학궤계평탄화（CMP）모재발전현상급추세，추단450 mm정원적CMP설비급기술적박절성；재차기출상，전망450 mm정원장회채용계통집성기술、다구역압력공제승재기기술、포광점수정기술、종점검측기술、후청세기술，병초보분석이상저사기술적특점。최후지출수착정원제조엄격렬경쟁화지속투자，대450 mm적CMP설비요구필유소돌파。
The paper analyze the current status and trend of the consumable, then alleging the urgently for developing the 450mm wafer's CMP tool and its technology;Basing on the viewpoint which above mentioned, the paper forecasts the 450mm CMP tools will adopt integrated technology、Multi-zone back pressure control technology、pad conditioner technology、endpoint detection technology、post CMP cleaning technology, then analyze each technology specialty. At last, the paperindicate the wafer fabrication compete drastically and invest continually in the near future, which must make the 450mm wafer's CMP tool break through.
