电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2014年
3期
14-17
,共4页
内串联型二极管%二极管%工艺控制
內串聯型二極管%二極管%工藝控製
내천련형이겁관%이겁관%공예공제
tandem type diode%diode%technology control
介绍一种新封装半导体器件的研发。通过对产品开发过程中各技术难点及相应解决方案的介绍，展现该产品的主要研发过程和所涉及到的关键技术难点。关键技术难点包括引线框架设计、设备改造、工艺控制等。引线框架（一种正向串联的二极管框架结构）设计产品的总体结构问题，是该过程的第一技术关键点。设备改造和工艺控制解决了生产实现和质量控制问题。
介紹一種新封裝半導體器件的研髮。通過對產品開髮過程中各技術難點及相應解決方案的介紹，展現該產品的主要研髮過程和所涉及到的關鍵技術難點。關鍵技術難點包括引線框架設計、設備改造、工藝控製等。引線框架（一種正嚮串聯的二極管框架結構）設計產品的總體結構問題，是該過程的第一技術關鍵點。設備改造和工藝控製解決瞭生產實現和質量控製問題。
개소일충신봉장반도체기건적연발。통과대산품개발과정중각기술난점급상응해결방안적개소，전현해산품적주요연발과정화소섭급도적관건기술난점。관건기술난점포괄인선광가설계、설비개조、공예공제등。인선광가（일충정향천련적이겁관광가결구）설계산품적총체결구문제，시해과정적제일기술관건점。설비개조화공예공제해결료생산실현화질량공제문제。
The paper mainly introduces the development of a new package of semiconductor device. The technical difficulties of the product development process and the corresponding solutions are presented, showing the main R&D process of the product and the key technical problems. The key technical problems including the lead frame design, equipment modiifcation, process control. Lead frame design(a frame structure for positive series of diode)determines the overall structure of the product, is the ifrst technical key points of the process. Modiifcation of equipment and process control to solve the production and quality control.
