CAJ | 학술논문

0.50 mm节距CQFP256封装电路在20000 g恒定加速度试验中出现瓷体开裂失效。利用Ansys Workbench仿真平台，对试验过程进行模拟仿真。结合电路失效照片和夹具实测数值，分析仿真结果，排除了封装设计和加工质量问题。而夹具的加工缺陷是导致电路瓷体开裂的主要原因。改进试验条件重新进行试验，电路100％通过20000 g试验。
0.50 mm절거CQFP256봉장전로재20000 g항정가속도시험중출현자체개렬실효。이용Ansys Workbench방진평태，대시험과정진행모의방진。결합전로실효조편화협구실측수치，분석방진결과，배제료봉장설계화가공질량문제。이협구적가공결함시도치전로자체개렬적주요원인。개진시험조건중신진행시험，전로100％통과20000 g시험。
Ceramic cracks occurred in the package of CQFP256 after the constant acceleration experiment of 20 000 g. The software of Ansys Workbench was used to simulate the experiment conditions. Problems of package design were excluded after analysis of simulation results. According to the photographs of failures in CQFP256 and the experiment ifxture, the CQFP256 design model was mended and simulation was re-carried out. The new simulation results demonstrated that defects in the ifxture contributed mainly to the ceramic cracks. Through the improvement accordingly, all of the CQFP256 had passed the constant acceleration experiment of 20 000 g.