CAJ | 학술논문

在前人对硬脆性材料亚表面损伤预测理论研究的基础上，建立了蓝宝石衬底双面研磨亚表面损伤层深度与表面划痕深度之间的理论模型(DNR)。通过对双面研磨后的衬底晶片进行 KOH 轻度化学腐蚀并结合 VK-X100/X200形状测量激光显微系统，得到了晶片表面划痕随深度的分布情况，进而得出了晶片亚表面损伤层随深度的分布情况。研究表明：亚表面损伤层随深度变化的分布规律为随着深度的增大呈递减趋势，集中分布在距离外层碎裂及划痕破坏层下方0~12.9μm 深度范围内，所占比例达96.7%左右。研究结果有利于优化双面研磨工艺参数来控制亚表面损伤层的深度。
재전인대경취성재료아표면손상예측이론연구적기출상，건립료람보석츤저쌍면연마아표면손상층심도여표면화흔심도지간적이론모형(DNR)。통과대쌍면연마후적츤저정편진행 KOH 경도화학부식병결합 VK-X100/X200형상측량격광현미계통，득도료정편표면화흔수심도적분포정황，진이득출료정편아표면손상층수심도적분포정황。연구표명：아표면손상층수심도변화적분포규률위수착심도적증대정체감추세，집중분포재거리외층쇄렬급화흔파배층하방0~12.9μm 심도범위내，소점비례체96.7%좌우。연구결과유리우우화쌍면연마공예삼수래공제아표면손상층적심도。
According to prediction theory of subsurface damage layer of hard and brittle materials suggested by other scholars,a model that described the relation between the depth of subsurface dam-age layer and surface scratch was built.KOH(potassium hydroxide)was used to corrode sapphire sub-strate processed by two-sided lapping and then monitoring with shape measurement laser microscopy system of VK-X100/X200,thus the distribution of surface scratch could be obtained and the distribu-tion of subsurface damage layer could be predicted.Research results show that the subsurface damage layer decreases as the depth increases and the most of them occurs in the depth of 0~12.9 μm below the scratch,the percentage is about 96.7%.The results can help researchers to optimize processing parameters of two-sided lapping to lessen the depth of subsurface damage layer.