CAJ | 학술논문

采用放电等离子烧结(SPS)技术制备不同Si含量的电子封装用Si/Al复合材料，测试复合材料的性能，包括密度、热导率、热膨胀系数及弯曲强度；进行成分及断口分析，研究Si含量对Si/Al复合材料微观组织及热、力学性能的影响规律。结果表明：Si/Al复合材料由Si、Al组成，Al均匀分布于Si晶粒之间；随着Si含量的降低，Si/Al复合材料的相对密度不断增大，当Si含量为50%(体积分数)时，复合材料的相对密度达到98.0%；复合材料的热导率、热膨胀系数及弯曲强度均随着Si含量的增加而减小，当Si含量为60%(体积分数)时，复合材料具有最佳的热导率、热膨胀系数及强度匹配。
채용방전등리자소결(SPS)기술제비불동Si함량적전자봉장용Si/Al복합재료，측시복합재료적성능，포괄밀도、열도솔、열팽창계수급만곡강도；진행성분급단구분석，연구Si함량대Si/Al복합재료미관조직급열、역학성능적영향규률。결과표명：Si/Al복합재료유Si、Al조성，Al균균분포우Si정립지간；수착Si함량적강저，Si/Al복합재료적상대밀도불단증대，당Si함량위50%(체적분수)시，복합재료적상대밀도체도98.0%；복합재료적열도솔、열팽창계수급만곡강도균수착Si함량적증가이감소，당Si함량위60%(체적분수)시，복합재료구유최가적열도솔、열팽창계수급강도필배。
Si/Al composites with different Si contents for electronic packaging were prepared by spark plasma sintering (SPS) technique. Properties of the composites were investigated, including density, thermal conductivity, coefficient of thermal expansion and flexural strength. The effects of the Si content on microstructure and thermal and mechanical properties of the composites were studied. The results show that the Si/Al composites consist of Si and Al components and Al uniformly distributes among Si grains. The relative density of the Si/Al composites gradually increases with the decrease of Si content and reaches 98.0% when the Si content is 50%. The thermal conductivity, the coefficient of thermal expansion and the flexural strength of the composite all decrease with the increase of the Si content, and an optimal matching of them is obtained when the Si content is 60%(volume fraction).