绝缘材料
絕緣材料
절연재료
INSULATING MATERIALS
2014年
2期
59-63
,共5页
双马来酰亚胺%二烯丙基双酚A%环氧树脂%改性%覆铜板
雙馬來酰亞胺%二烯丙基雙酚A%環氧樹脂%改性%覆銅闆
쌍마래선아알%이희병기쌍분A%배양수지%개성%복동판
bismaleimide%diallyl bisphenol A%epoxy resin%modification%copper clad laminate
采用二烯丙基双酚A(DABPA)对4,4'-双马来酰亚胺基二苯甲烷(BMI)进行改性，然后与环氧树脂和4,4'-二氨基二苯砜（DDS）共混制得覆铜板，并对改性BMI树脂和覆铜板分别进行了结构表征和性能测试。结果表明：研制的覆铜板阻燃等级达到V-0，并具有较好的介电性能、耐热性能以及力学性能。
採用二烯丙基雙酚A(DABPA)對4,4'-雙馬來酰亞胺基二苯甲烷(BMI)進行改性，然後與環氧樹脂和4,4'-二氨基二苯砜（DDS）共混製得覆銅闆，併對改性BMI樹脂和覆銅闆分彆進行瞭結構錶徵和性能測試。結果錶明：研製的覆銅闆阻燃等級達到V-0，併具有較好的介電性能、耐熱性能以及力學性能。
채용이희병기쌍분A(DABPA)대4,4'-쌍마래선아알기이분갑완(BMI)진행개성，연후여배양수지화4,4'-이안기이분풍（DDS）공혼제득복동판，병대개성BMI수지화복동판분별진행료결구표정화성능측시。결과표명：연제적복동판조연등급체도V-0，병구유교호적개전성능、내열성능이급역학성능。
A copper clad laminate was prepared by blending 4, 4'-diphenyl bismaleimide(BMI) modified by diallyl bisphenol A, epoxy resin and diamine(DDS), and the structure of the modified BMI and the properties of the copper clad laminate were studied. The results show that the copper clad laminate has good dielectric properties, thermal stability and mechanical properties, and the flame retardancy grade reaches V-0.
