粘接
粘接
점접
2014年
4期
54-57
,共4页
夏兰君%李福志%熊和建%管蓉%鲁德平
夏蘭君%李福誌%熊和建%管蓉%魯德平
하란군%리복지%웅화건%관용%로덕평
环氧树脂%二苯基硅二醇(DSPD)%室温固化
環氧樹脂%二苯基硅二醇(DSPD)%室溫固化
배양수지%이분기규이순(DSPD)%실온고화
epoxy resin%dihydroxydiphenylsilane%room-temperature cure
采用二苯基硅二醇(DSPD)改性双酚A型环氧树脂 E-51制备了有机硅改性的环氧树脂,采用硫脲改性聚酰胺650制备了室温快速固化的环氧固化剂。合成产物通过红外进行表征,用盐酸-丙酮法测定改性环氧树脂的环氧值,通过指干时间确定聚酰胺650和改性聚酰胺650与E-51的较优配比。通过差示扫描量热分析法 DSC 和热重分析法 TG 表征改性环氧树脂固化物的耐热性,通过拉伸性能和扫描电镜测试 SEM 表征改性环氧树脂固化物的韧性。实验结果表明,环氧树脂经改性后,其玻璃化温度升高了27℃,与聚酰胺650固化后,固化产物的起始热分解温度明显增加,失重50%的分解温度升高了180℃,固化物的断裂伸长率增加了3.41%,断裂面呈现明显韧性断裂特征。()()()()
採用二苯基硅二醇(DSPD)改性雙酚A型環氧樹脂 E-51製備瞭有機硅改性的環氧樹脂,採用硫脲改性聚酰胺650製備瞭室溫快速固化的環氧固化劑。閤成產物通過紅外進行錶徵,用鹽痠-丙酮法測定改性環氧樹脂的環氧值,通過指榦時間確定聚酰胺650和改性聚酰胺650與E-51的較優配比。通過差示掃描量熱分析法 DSC 和熱重分析法 TG 錶徵改性環氧樹脂固化物的耐熱性,通過拉伸性能和掃描電鏡測試 SEM 錶徵改性環氧樹脂固化物的韌性。實驗結果錶明,環氧樹脂經改性後,其玻璃化溫度升高瞭27℃,與聚酰胺650固化後,固化產物的起始熱分解溫度明顯增加,失重50%的分解溫度升高瞭180℃,固化物的斷裂伸長率增加瞭3.41%,斷裂麵呈現明顯韌性斷裂特徵。()()()()
채용이분기규이순(DSPD)개성쌍분A형배양수지 E-51제비료유궤규개성적배양수지,채용류뇨개성취선알650제비료실온쾌속고화적배양고화제。합성산물통과홍외진행표정,용염산-병동법측정개성배양수지적배양치,통과지간시간학정취선알650화개성취선알650여E-51적교우배비。통과차시소묘량열분석법 DSC 화열중분석법 TG 표정개성배양수지고화물적내열성,통과랍신성능화소묘전경측시 SEM 표정개성배양수지고화물적인성。실험결과표명,배양수지경개성후,기파리화온도승고료27℃,여취선알650고화후,고화산물적기시열분해온도명현증가,실중50%적분해온도승고료180℃,고화물적단렬신장솔증가료3.41%,단렬면정현명현인성단렬특정。()()()()
The silicone modified epoxy resin was synthesized by the reaction of a bisphenol A type resin epoxy (E-51) and dihydroxydiphenylsilane (DSPD),a room-temperature and quick curing agent was prepared from polyamide 650 modified with thiourea.The products were tested by IR spectroscopy, the epoxide number of the modified epoxy resin was determined by the hydrochloric acid-acetone method, and the optimum ratio of polyamide 650 and modified polyamide 650 to epoxy resin E-51 was determined by tack free time.The heat resistance of the cured products of modified epoxy resin was characterized by differential scanning calorimetry analysis (DSC) and thermal gravimetric analysis (TG).Moreover,the toughness of the cured products of modified epoxy resin was characterized by tensile test and scanning electron microscopy (SEM).The experimental results showed that the glass transition temperature (Tg) of modified epoxy resin was increased by 27℃ ,the onset temperature of weight loss was increased obviously after curing with polyamide 650,the thermal decomposition temperature for 50%weight loss was 150℃ higher than that of the unmodified epoxy resin,the elongation at break of the cured product increased by 3.41%,in addition,the fracture surface showed obviously the ductile fracture characteristics from SEM images.