CAJ | 학술논문

将γ-缩水甘油醚氧丙基三甲氧基硅烷（KH560）与环氧树脂（EP）预反应，采用黏度计、万能电子材料试验机、红外光谱、差示扫描量热仪，考查了KH560含量对EP/改性聚酰胺室温固化环氧结构胶性能的影响。结果表明，KH560含量从0增加至9质量份（每100份EP中加入量）时，胶体拉伸强度从51 MPa降低至36.5 MPa；压缩强度从79.7 MPa降低至53 MPa；粘接强度从8.7 MPa增至11.7 MPa。同时，固化物的热稳定性也有一定程度提高，未改性及9份KH560改性的EP固化物50%热失重的温度分别为382.1℃与403.6℃。
장γ-축수감유미양병기삼갑양기규완（KH560）여배양수지（EP）예반응，채용점도계、만능전자재료시험궤、홍외광보、차시소묘량열의，고사료KH560함량대EP/개성취선알실온고화배양결구효성능적영향。결과표명，KH560함량종0증가지9질량빈（매100빈EP중가입량）시，효체랍신강도종51 MPa강저지36.5 MPa；압축강도종79.7 MPa강저지53 MPa；점접강도종8.7 MPa증지11.7 MPa。동시，고화물적열은정성야유일정정도제고，미개성급9빈KH560개성적EP고화물50%열실중적온도분별위382.1℃여403.6℃。
The prepolymer was synthesized by reaction of 3-Glycidyloxypropyltrimethoxysilane (KH560) and epoxy resin (EP).The effect of KH560 content on the performance of EP-modified polyamide structural adhesive curable at room temperature was systematically investigated by means of viscometer,universal electric material testing machine,FT-IR spectroscopy and differential scanning calorimetry.The results indicated that the mechanical properties of the modified room temperature curable epoxy adhesive were remarkly decreased after introducing 9 phr KH560.More specifically,the tensile strength and compressive strength were decreased from 51 MPa to 36.5 MPa and 79.7 MPa to 53 MPa,respectively.The bonding strength was improved with introducing KH560 into the epoxy network.When the addition amount of KH560 was 9 phr,the shear strength of joints was increased from 8.7 MPa to 11.7 MPa,and the thermal stability of the cured products was improved to some extent:the temperature for 50%weight loss of unmodified and KH560-modified EP cured products were 382.1℃and 403.6℃, respectively.