粘接
粘接
점접
2014年
4期
35-39
,共5页
薛刚%张斌%孙明明%张绪刚%李坚辉%梅格%王磊%赵明%宋彩雨%李奇力
薛剛%張斌%孫明明%張緒剛%李堅輝%梅格%王磊%趙明%宋綵雨%李奇力
설강%장빈%손명명%장서강%리견휘%매격%왕뢰%조명%송채우%리기력
硼硅酚醛树脂%有机硅预聚物%硼酸%SiO2
硼硅酚醛樹脂%有機硅預聚物%硼痠%SiO2
붕규분철수지%유궤규예취물%붕산%SiO2
boron-and-silicone-containing phenolic resin%silicone prepolymer%boric acid%SiO2
在合成酚醛树脂的过程中引入有机硅预聚物和硼酸，制得硼硅酚醛树脂，并在此基础上加入正硅酸乙酯，原位水解生成SiO2，进一步改性了硼硅酚醛树脂。分别考查了有机硅预聚物、硼酸和正硅酸乙酯加入量对改性酚醛树脂粘接强度的影响。通过IR考查了改性树脂的结构，硼氧键和硅氧键成功地引入到酚醛树脂中。还通过DSC和不同条件下粘接强度的测试考查了改性树脂的固化性能，确定了其固化工艺。空气气氛中的热重分析则表明改性酚醛树脂初始分解温度为475℃，1000℃残炭率为21%，耐热性明显优于普通酚醛树脂。
在閤成酚醛樹脂的過程中引入有機硅預聚物和硼痠，製得硼硅酚醛樹脂，併在此基礎上加入正硅痠乙酯，原位水解生成SiO2，進一步改性瞭硼硅酚醛樹脂。分彆攷查瞭有機硅預聚物、硼痠和正硅痠乙酯加入量對改性酚醛樹脂粘接彊度的影響。通過IR攷查瞭改性樹脂的結構，硼氧鍵和硅氧鍵成功地引入到酚醛樹脂中。還通過DSC和不同條件下粘接彊度的測試攷查瞭改性樹脂的固化性能，確定瞭其固化工藝。空氣氣氛中的熱重分析則錶明改性酚醛樹脂初始分解溫度為475℃，1000℃殘炭率為21%，耐熱性明顯優于普通酚醛樹脂。
재합성분철수지적과정중인입유궤규예취물화붕산，제득붕규분철수지，병재차기출상가입정규산을지，원위수해생성SiO2，진일보개성료붕규분철수지。분별고사료유궤규예취물、붕산화정규산을지가입량대개성분철수지점접강도적영향。통과IR고사료개성수지적결구，붕양건화규양건성공지인입도분철수지중。환통과DSC화불동조건하점접강도적측시고사료개성수지적고화성능，학정료기고화공예。공기기분중적열중분석칙표명개성분철수지초시분해온도위475℃，1000℃잔탄솔위21%，내열성명현우우보통분철수지。
The boron- and- silicone-containing phenolic resin(BSPR) was prepared by introducing organic silicon prepolymer and boric acid during synthesis process of the phenol resin,and then the BSPR was further modified with SiO2 formed by in-situ hydrolysis of introduced tetraethyl orthoslicate(TEOS).The effect of contents of the silicone prepolymer,boric acid and TEOS on the shear strength was studied.The structure of resin was characterized by infrared spectroscopy,and from the results we can know that the B-O and Si-O bonds were introduced into the phenolic resin successfully.The curing properties and the curing process were investigated by DSC and the test of adhesion strength, respectively.The thermal analysis (TGA) showed that the modified phenolic resin has outstanding heat-resistance,its initial decomposition temperature is 475℃,the carbon yield is 21%when the temperature reaches 1 000℃.
