浙江师范大学学报(自然科学版)
浙江師範大學學報(自然科學版)
절강사범대학학보(자연과학판)
JOURNAL OF ZHEJIANG NORMAL UNIVERSITY(NATURAL SCIENCES)
2014年
2期
121-125
,共5页
黄仕华%董晶%沈佳露%刘剑
黃仕華%董晶%瀋佳露%劉劍
황사화%동정%침가로%류검
PECVD%非晶硅薄膜%掺杂%氢稀释度%电导率
PECVD%非晶硅薄膜%摻雜%氫稀釋度%電導率
PECVD%비정규박막%참잡%경희석도%전도솔
PECVD%amorphous silicon thin film%doping concentration%hydrogen dilution%conductivity
采用等离子增强化学气象沉积(plasma enhanced chemical vapor deposition,PECVD)法在普通玻璃上沉积非晶硅薄膜材料.通过控制变量分别研究了 p,n 层的掺杂浓度、氢稀释度及 i 层的反应气压对薄膜材料性能的影响.结果表明:p 层材料在掺杂浓度为6.67%、氢稀释度为10.6时有较高的暗电导率和较低的沉积速率;n 层材料在掺杂浓度为3.33%、氢稀释度为8.3时有较高的暗电导率和较低的沉积速率;i 层材料在反应气压为95 Pa、氢稀释度为15时有较高的光暗电导率之比.
採用等離子增彊化學氣象沉積(plasma enhanced chemical vapor deposition,PECVD)法在普通玻璃上沉積非晶硅薄膜材料.通過控製變量分彆研究瞭 p,n 層的摻雜濃度、氫稀釋度及 i 層的反應氣壓對薄膜材料性能的影響.結果錶明:p 層材料在摻雜濃度為6.67%、氫稀釋度為10.6時有較高的暗電導率和較低的沉積速率;n 層材料在摻雜濃度為3.33%、氫稀釋度為8.3時有較高的暗電導率和較低的沉積速率;i 層材料在反應氣壓為95 Pa、氫稀釋度為15時有較高的光暗電導率之比.
채용등리자증강화학기상침적(plasma enhanced chemical vapor deposition,PECVD)법재보통파리상침적비정규박막재료.통과공제변량분별연구료 p,n 층적참잡농도、경희석도급 i 층적반응기압대박막재료성능적영향.결과표명:p 층재료재참잡농도위6.67%、경희석도위10.6시유교고적암전도솔화교저적침적속솔;n 층재료재참잡농도위3.33%、경희석도위8.3시유교고적암전도솔화교저적침적속솔;i 층재료재반응기압위95 Pa、경희석도위15시유교고적광암전도솔지비.
The amorphous silicon thin film was deposited on glass by using plasma enhanced chemical vapor deposition(PECVD)method. The influence of doping concentration and hydrogen dilution on thin film prop-erty,and the influence of reaction pressure on the i-layer property were investigated. The results indicated that the p-layer had a higher dark-conductivity and a lower deposition rate when the doping concentration and the hydrogen dilution were about 6. 67% and 10. 6,respectively. The n-layer had a higher dark-conductivity and a lower deposition rate when the doping concentration and the hydrogen dilution were about 3. 33% and 8. 3, respectively. Also the i-layer thin film had a higher photoconductivity and a dark-conductivity ratio when the reaction pressure and the hydrogen dilution were about 95 Pa and 15,respectively.