CAJ | 학술논문

多点焊，局部焊又称选择性焊接，就是指对PCB上特定位置的电子元件进行“有选择性”焊接。选择性焊接不同于波峰焊接，选择性焊接的焊料是定位喷射的，而PCB板则在喷射的焊料上面移动。治具都是根据PCB板上元件的位置定制。目前，这种工艺已经越来越多地用于小批量有一定数量后装件的产品上。我公司产品由于存在这种生产特点，所以因生产需要，开发研制了一台局部喷流焊锡炉，经现场多年使用，焊接效果好，质量稳定，成为公司的重要设备之一。
다점한，국부한우칭선택성한접，취시지대PCB상특정위치적전자원건진행“유선택성”한접。선택성한접불동우파봉한접，선택성한접적한료시정위분사적，이PCB판칙재분사적한료상면이동。치구도시근거PCB판상원건적위치정제。목전，저충공예이경월래월다지용우소비량유일정수량후장건적산품상。아공사산품유우존재저충생산특점，소이인생산수요，개발연제료일태국부분류한석로，경현장다년사용，한접효과호，질량은정，성위공사적중요설비지일。
Local spray soldering is known as multiple spot soldering, or selective soldering. It refers to selective soldering components of specified location on PCB. Nowadays, this technology is more and more applied to those small batch products which have a number of post plug-in components. In order to meet the need of production for such products in our company, this equipment is designed and developed independently. This paper introduces its design principle, system structure and control flow etc. Through its use on site for more than a year, it has achieved the good soldering effects and stable quality.