CAJ | 학술논문

随着电子芯片功耗不断增大，散热问题已经成为电子设备，特别是大型高密度电子设备发展的瓶颈问题。中国科学院电工研究所自主研发的蒸发冷却技术，其利用冷却介质的相变潜热带走热量，冷却能力较传统风冷等冷却技术有很大优势。其在电子设备上的应用首要问题之一是冷却介质与电力电子器件材料之间的相容性问题。本文详细介绍了蒸发冷却介质与电子设备材料相容性实验研究情况，并对实验结果进行了分析，为蒸发冷却介质与IT设备材料的相容性筛选提供了指导，这将为未来蒸发冷却技术应用于大型电子设备的冷却提供重要技术支撑。
수착전자심편공모불단증대，산열문제이경성위전자설비，특별시대형고밀도전자설비발전적병경문제。중국과학원전공연구소자주연발적증발냉각기술，기이용냉각개질적상변잠열대주열량，냉각능력교전통풍랭등냉각기술유흔대우세。기재전자설비상적응용수요문제지일시냉각개질여전력전자기건재료지간적상용성문제。본문상세개소료증발냉각개질여전자설비재료상용성실험연구정황，병대실험결과진행료분석，위증발냉각개질여IT설비재료적상용성사선제공료지도，저장위미래증발냉각기술응용우대형전자설비적냉각제공중요기술지탱。
With the development of the electronics and information technology, the heat dissipation problem has be?come the development bottleneck of electronic equipment, especially large?scale high?density electronic devices. E?vaporative cooling technology of the Institute of Electrical Engineering, Chinese Academy of Sciences, utilizing phase change latent of cooling medium, cooling capacity has the great advantage than traditional air?cooled cooling technology. When it is applied to large electronic equipment cooling, material compatibility is an important prob?lem, which requires the first study. This paper describes materials compatibility experimental research and analysis between cooling media and electronic equipment. And the experimental results provide cooling media screening guidance for electronic equipment, which provide important technical support for evaporative cooling technology ap?plying to large?scale electronic equipment, in future.