CAJ | 학술논문

探讨了材料类型、密度、含水率、测试温度等因素对硅酸钙板导热系数的影响。结果表明，硅酸钙板的结构类型不同，其导热系数会存在较大差别；密度越小，其孔隙率相对越大，导热系数值就会越小；导热系数随着含水率的增加出现先缓慢增加再迅速增加后趋于平稳的趋势；绝干或含水率较低情况下，其导热系数随着平均温度的升高而增大，且密度等级越低，增幅越大，但由于加热法测量导热系数的过程中存在湿分迁移效应，当含湿量超过一定值时(约8%~10%)，测试平均温度越高，其导热系数反而越小。
탐토료재료류형、밀도、함수솔、측시온도등인소대규산개판도열계수적영향。결과표명，규산개판적결구류형불동，기도열계수회존재교대차별；밀도월소，기공극솔상대월대，도열계수치취회월소；도열계수수착함수솔적증가출현선완만증가재신속증가후추우평은적추세；절간혹함수솔교저정황하，기도열계수수착평균온도적승고이증대，차밀도등급월저，증폭월대，단유우가열법측량도열계수적과정중존재습분천이효응，당함습량초과일정치시(약8%~10%)，측시평균온도월고，기도열계수반이월소。
The effects of material type, density, moisture content, test temperature, etc. on thermal conductivity of cal-cium silicate board are studied. The results show that its thermal conductivity differs according to its structure and type. The smaller the density, the greater the relative porosity, which leads to the smaller thermal conductivity. The thermal con-ductivity increases slowly at first and then rapidly increases and last tends to be constant with the increase of moisture content. Under the condition of absolutely dry or low moisture content of the sample, the thermal conductivity increases with the increase of the average temperature, and the lower the density grade, the faster the growth of the thermal conduc-tivity is. However, due to the moisture migration, the higher the average test temperature, the smaller its thermal conductiv-ity is, when the moisture content exceeds a certain value (about 8%to 10%).