CAJ | 학술논문

采用电化学测试方法研究了焦磷酸盐溶液体系在铜电极表面电沉积Cu及Cu-Sn合金(低Sn)的电化学行为。探讨了添加剂JZ-1对电沉积Cu和Cu-Sn合金的影响，并对电沉积层的表面形貌和晶相结构进行分析。结果表明，焦磷酸盐溶液体系电沉积Cu及Cu-Sn合金均为不可逆电极过程，发生电化学极化。电沉积 Cu 的阴极过程表现为前置转化反应很快和以227CuP O -直接还原的反应机理形式。电沉积Cu-Sn合金过程中Cu与Sn之间存在相互作用，溶液中的Cu2+与Sn2+也存在相互促进电沉积的作用，Cu-Sn合金的晶相结构为Cu13.7Sn。添加剂JZ-1具有促进Cu电沉积和抑制Sn电沉积的双重作用，有利于降低Cu-Sn合金中的Sn含量并细化晶粒。
채용전화학측시방법연구료초린산염용액체계재동전겁표면전침적Cu급Cu-Sn합금(저Sn)적전화학행위。탐토료첨가제JZ-1대전침적Cu화Cu-Sn합금적영향，병대전침적층적표면형모화정상결구진행분석。결과표명，초린산염용액체계전침적Cu급Cu-Sn합금균위불가역전겁과정，발생전화학겁화。전침적 Cu 적음겁과정표현위전치전화반응흔쾌화이227CuP O -직접환원적반응궤리형식。전침적Cu-Sn합금과정중Cu여Sn지간존재상호작용，용액중적Cu2+여Sn2+야존재상호촉진전침적적작용，Cu-Sn합금적정상결구위Cu13.7Sn。첨가제JZ-1구유촉진Cu전침적화억제Sn전침적적쌍중작용，유리우강저Cu-Sn합금중적Sn함량병세화정립。
The electrochemical behaviors of Cu and low-Sn Cu-Sn alloy electrodeposition on copper electrode from aqueous pyrophosphate bath were studied by electrochemical test methods. The effect of additive JZ-1 on Cu and Cu-Sn alloy electrodeposition was discussed and the surface morphologies and crystal structures of electrodeposited coatings were analyzed. The results showed that both Cu and Cu-Sn alloy electrodeposition from aqueous pyrophosphate bath are irreversible electrode process, during which electrochemical polarization happens. It was considered that the reaction mechanism of the cathodic process of Cu electrodeposition consists of fast preceding chemical transformation step and direct reduction of 22 7CuP O -. There is interaction between Cu and Sn during Cu-Sn alloy electrodeposition process, as well as mutual promotion between Cu2+ and Sn2+in electrodeposition. The crystal structure of Cu-Sn alloy is Cu13.7Sn. The additive JZ-1 has a dual role of promoting Cu electrodeposition and inhibiting Sn electrodeposition, which is benefit for the reduction of Sn content in Cu-Sn alloy and grain refinement.