CAJ | 학술논문

介绍了一种用于铜膜化学机械抛光的多元胺醇型非离子表面活性剂。研究了该表面活性剂对抛光液表面张力、黏度、粒径、抛光速率和抛光后铜的表面状态的影响。抛光液的基本组成和工艺条件为：SiO20.5%，H2O20.5%，FA/OII 型螯合剂5%(以上均为体积分数)，工作压力2 psi，抛头转速60 r/min，抛盘转速65 r/min，抛光液流量150 mL/min，抛光时间3 min，抛光温度21°C。结果表明，微量表面活性剂的加入能显著降低抛光液的表面张力并大幅提高抛光液的稳定性，但对静置24 h后抛光液黏度的影响不大。表面活性剂含量为0%~2%时，随其含量增大，化学机械抛光速率减小，抛光面的粗糙度降低。
개소료일충용우동막화학궤계포광적다원알순형비리자표면활성제。연구료해표면활성제대포광액표면장력、점도、립경、포광속솔화포광후동적표면상태적영향。포광액적기본조성화공예조건위：SiO20.5%，H2O20.5%，FA/OII 형오합제5%(이상균위체적분수)，공작압력2 psi，포두전속60 r/min，포반전속65 r/min，포광액류량150 mL/min，포광시간3 min，포광온도21°C。결과표명，미량표면활성제적가입능현저강저포광액적표면장력병대폭제고포광액적은정성，단대정치24 h후포광액점도적영향불대。표면활성제함량위0%~2%시，수기함량증대，화학궤계포광속솔감소，포광면적조조도강저。
A kind of multiple amino alcohol nonionic surfactant applied to the chemical-mechanical polishing of copper film was introduced. The effect of the surfactant on the surface tension, viscosity, particle size, and polishing rate of polishing solution and the surface state of polished copper were studied. The basic composition of polishing solution and process parameters are as follows: SiO2 0.5vol%, H2O2 0.5vol%, FA/OII chelating agent 5vol%, working press 2 psi, rotation rate of polishing head 60 r/min, rotation rate of polishing disc 65 r/min, flow rate of polishing solution 150 mL/min, polishing time 3 min, and polishing temperature 21 °C. The results showed that the addition of a trace amount of surfactant can reduce the surface tension and improve the stability of polishing solution markedly, but has slight impact on the viscosity of polishing solution after storage for 24 h. The chemical-mechanical polishing rate as well as the roughness of polished surface are reduced with the increasing of surfactant content in the range of 0%-2%.