CAJ | 학술논문

研究了不同浓度的 S-羧乙基异硫脲鎓盐(ATPN)对酸性化学镀镍的沉积速率和镀层表面形貌的影响，通过极化曲线研究了化学镍的阴、阳极过程。结果表明，ATPN 能使镀层表面结晶细致。在ATPN的添加量小于11 mg/L时，ATPN 通过其分子中的S原子的电子效应，降低次磷酸根在镍表面的吸附能，因此随着ATPN的增加，次磷酸钠氧化加快，化学镀镍沉积速率加快。当ATPN添加量超过11 mg/L后，ATPN与镍形成很稳定的表面吸附配合物，减少了次磷酸钠在镍表面的吸附，因此随ATPN添加，次磷酸钠氧化受到抑制，沉积速率变小。当镍表面被ATPN完全覆盖，则会发生停镀或者不起镀。适宜的ATPN添加量为8~13 mg/L。
연구료불동농도적 S-최을기이류뇨옹염(ATPN)대산성화학도얼적침적속솔화도층표면형모적영향，통과겁화곡선연구료화학얼적음、양겁과정。결과표명，ATPN 능사도층표면결정세치。재ATPN적첨가량소우11 mg/L시，ATPN 통과기분자중적S원자적전자효응，강저차린산근재얼표면적흡부능，인차수착ATPN적증가，차린산납양화가쾌，화학도얼침적속솔가쾌。당ATPN첨가량초과11 mg/L후，ATPN여얼형성흔은정적표면흡부배합물，감소료차린산납재얼표면적흡부，인차수ATPN첨가，차린산납양화수도억제，침적속솔변소。당얼표면피ATPN완전복개，칙회발생정도혹자불기도。괄의적ATPN첨가량위8~13 mg/L。
The effects of different concentrations of S-carboxyethylisothiuronium betaine (ATPN) on deposition rate of acidic electroless nickel plating and surface morphology of the Ni–P coating obtained were discussed. The anodic and cathodic courses of electroless nickel plating were studied by polarization curve measurement. The results indicated that the addition of ATPN can refine grains. When the amount of ATPN is less than 11 mg/L, the oxidation rate of hypophosphite is increased with increasing ATPN amount due to the fact that ATPN reduces the adsorption energy of hypophosphite on the surface of nickel by the electronic effect of atom S in the ATPN molecule, leading to an increased deposition rate of nickel. When the amount of ATPN is over 11 mg/L, the oxidation of hypophosphite is inhibited and the deposition rate is decreased due to the formation of a very stable adsorption compound of ATPN and nickel on nickel surface, reducing the adsorption of hypophosphite. When the surface of nickel is completely covered by ATPN, the electroless deposition of nickel is stop.The suitable dosage of ATPN is 8-13 mg/L.