CAJ | 학술논문

在现代电子工业中，由于电子技术的快速发展，印制电路板（PCB）在各个领域得到了广泛应用。随着表面贴装技术（SMT）的发展，PCB板上的元件密度越来越高。为了完成PCB板的制作与使用，需要对其中的PCB Mark进行定位和校准，主要讨论了一个基于Hough变化和最小二乘方法下的定位校准方法，为多边形的印刷电路板识别符（PCB Mark）定位校准技术提供了一个新思路。
재현대전자공업중，유우전자기술적쾌속발전，인제전로판（PCB）재각개영역득도료엄범응용。수착표면첩장기술（SMT）적발전，PCB판상적원건밀도월래월고。위료완성PCB판적제작여사용，수요대기중적PCB Mark진행정위화교준，주요토론료일개기우Hough변화화최소이승방법하적정위교준방법，위다변형적인쇄전로판식별부（PCB Mark）정위교준기술제공료일개신사로。
With the rapid development of electronics technology in the modern electronic industry,printed circuit board (PCB)has been widely used in various fields. At the same time,with the development of surface mount technology(SMT),the density of components on PCB is higher and higher. In order to manufacture and use PCB,PCB Mark in PCB should be located and calibrated. A positioning and calibration method based on Hough transform and least square method is discussed in this pa-per for providing a new method for positioning and calibration technology of the polygon PCB Mark.